Industry News | 2023-10-30 19:15:13.0
Indium Corporation has earned a Mexico Technology Award for its new low-voiding, Pb-free solder paste, Indium8.9HFRV. The award was presented during an awards ceremony on October 25 at the SMTA Guadalajara Expo and Tech Forum in Jalisco, Mexico.
New Equipment | Cleaning Equipment
The first ergonomicly designed front-loading ultrasonic stencil cleaner The ErgoSonic Model Stencil & Pallet Cleaner is fully automatic and programmable. The operator loads the stencil into an empty chamber and selects the desired cleaning profile.
Industry News | 2012-03-28 15:59:44.0
Nihon Superior Shanghai Co. Ltd., a subsidiary of Nihon Superior Co. Ltd. will showcase a new and expanded range of products based on its SN100C® silver-free, lead-free solder at the upcoming NEPCON China 2012 exhibition in Shanghai.
Industry News | 2019-08-16 10:30:21.0
T.C. Loy, KYZEN Sdn Bhd's Technical Sales Manager, will present at the 2019 IPC Southeast Asia High Reliability Conference - Thailand. Loy will present: "Developing Cleaning Process Parameters."
New Equipment | Rework & Repair Equipment
Cost Effective Rework of Medium Size Boards The FINEPLACER® coreplus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price. The system offers proven rework technology for a wide spectrum
New Equipment | Wave Soldering
Solder Recovery System Turns Dross into Dollars. The Solder Recovery System enables PCB manufacturers to recycle solder onsite directly from their wave solder machines. The EVS by Sono-Tek solder recycling system saves up to 50% in solder costs in
New Equipment | Rework & Repair Equipment
FINEPLACER® pico rs is an enhanced hot air rework station for assembly and rework of all types of SMD components. The system is a best seller for professional mobile device rework in high density environments. A high level of process modularity allo
Industry News | 2010-09-27 23:01:06.0
Christopher Associates/Koki Solder announces that Jasbir Bath will present a paper titled “An Investigation into the Development of Lead-Free Solder Paste for Package on Package (PoP) Component Manufacturing Applications” at the upcoming SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2011-04-27 20:01:01.0
BTU International will highlight its new dual-lane, dual-speed capabilities of the PYRAMAX™ solder reflow system, as well as next generation high efficiency flux management, in Booth #1B08 at the upcoming NEPCON China 2011, scheduled to take place May 11-13, 2011 in Shanghai, China.
