Technical Library | 2019-06-26 23:21:49.0
Copper-filled micro-vias are a key technology in high density interconnect (HDI) designs that have enabled increasing miniaturization and densification of printed circuit boards for the next generation of electronic products. Compared with standard plated through holes (PTHs) copper filled vias provide greater design flexibility, improved signal performance, and can potentially help reduce layer count, thus reducing cost. Considering these advantages, there are strong incentives to optimize the via filling process. This paper presents an innovative DC acid copper via fill formulation, for VCP (Vertical Continues Plating) applications which rapidly fills vias while minimizing surface plating.
Technical Library | 2019-12-18 23:28:07.0
Electronic tongue systems equipped with cross-sensitive potentiometric sensors have been applied to pharmaceutical analysis, due to the possibility of various applications and developing new formulations. Many studies already proved the complementarity between the electronic tongue and classical analysis such as dissolution tests indicated by Pharmacopeias. However, as a new approach to study pharmaceuticals, electronic tongues lack strict testing protocols and specification limits; therefore, their results can be improperly interpreted and inconsistent with the reference studies. Therefore, all aspects of the development, measurement conditions, data analysis, and interpretation of electronic tongue results were discussed in this overview. The critical evaluation of the effectiveness and reliability of constructed devices may be helpful for a better understanding of electronic tongue systems development and for providing strict testing protocols.
Technical Library | 2021-12-16 01:48:41.0
Package-on-Package (PoP) technology is widely used in mobile devices due to its simple design, lower cost and faster time to market. Warpage characteristic and requirement of PoP package becomes critical to ensure both the top and bottom package can be mounted with minimal yield lost. With this challenge in placed, iNEMI has been working relentlessly to fingerprint the current PoP package technology warpage characteristic and to establish some key learning for packaging technologies. The work also extended to understand the basic requirement needed for successful PoP stacking by analyzing the warpage data obtained and formulate a simple analytical equation to explain the true warpage requirement for PoP packaging.
Design-Expert software allows users to make breakthrough improvements to product quality and process efficiency. Experimenters can screen for vital factors, locate ideal process settings for top performance, and discover optimal product formulations
Made from 100% nitrile, a preferred alternative to the traditional natural rubber latex fingercot. The QRP proprietary formulation of 100% nitrile is completely free of latex and latex proteins. Inherently anti-static, the 9C fingercot is ideal for u
The I-2000 Series of UV printing inks were designed for heat sensitive substrates in a wide spectrum of colors. Resistant to solvents, acids and bases, these UV inks will pass Military Specifications 893 and 775. Lite Fast I-2000 adheres to a wide
New Equipment | Solder Materials
KappFree solder is a Lead Free, Cadmium Free formulation designed specifically to replace Lead solders in Copper and Stainless Steel plumbing, and in electrical and electronic applications. KappFree is simple, effective and easy to use in both manufa
New Equipment | Solder Materials
KappFree solder is a Lead Free, Cadmium Free formulation designed specifically to replace Lead solders in Copper and Stainless Steel plumbing, and in electrical and electronic applications. KappFree is simple, effective and easy to use in both manufa
New Equipment | Solder Materials
Galvanite solder is a lead-free formulation designed specifically for high quality repairs to galvanized steel surfaces. Galvanite is simple, effective and easy to use, in both manufacturing and field applications. Just like the original galvanizing,
New Equipment | Solder Materials
Kapp Golden Flux™ PASTE has been designed specifically for soldering Aluminum to Aluminum and Copper. Kapp Golden Flux™ PASTE stays where you put it. It is designed for use on Aluminum-to-Aluminum or Aluminum-to-Copper sheets and tabs where fluxing a
