Full Site - : fpga thermal bonding (Page 15 of 59)

Krayden Releases 3-6751 Thermally Conductive Adhesive from Dow Corning

Industry News | 2010-11-09 19:19:27.0

Krayden, Inc. debuts Dow Corning’s 3-6751 Thermally Conductive Adhesive used for bonding heat sinks to electronic devices and PCBs to substrates.

Krayden Inc.

BTU Celebrates 70 Years in 2020

Industry News | 2020-02-01 05:21:42.0

BTU International is celebrating its 70-year anniversary. Since 1950, and with more than 10,000 units shipped, BTU International has been the trusted name for high-tech customers with a need to solve high-volume thermal processing challenges.

BTU International

High Accuracy Die Bonder on display at Semicon West 2009

Industry News | 2009-06-23 19:41:14.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 712 at the upcoming Semicon West, scheduled to take place July 14-16, 2009 at the Moscone Center in San Francisco, Ca.

Finetech

YINCAE Advanced Materials Wins Global Technology Award at SMTAI 2022 for Adhesives/Underfills/Encapsulants

Industry News | 2022-11-08 14:43:06.0

YINCAE Advanced Materials, LLC is proud to announce that our company was awarded the 2022 Global Technology Award in the Adhesives, Underfills, and Encapsulants category! This ceremony took place on Wednesday, November 2nd at SMTAI 2022 Exhibition in Minneapolis, USA.

YINCAE Advanced Materials, LLC.

No Surprise: 2001 a Tough Year for Sheldahl

Industry News | 2002-04-11 08:13:43.0

Sheldahl�s Sales Slipped 21% in 2001, According to the Company�s Filing With the U.S. Securities Exchange Commission

Sheldahl, Inc.

NEPCON China 2008 - FINEPLACER�Lambda

Industry News | 2008-04-07 21:09:26.0

FINETECH announces that it will display the FINEPLACER� Lambda system at the upcoming NEPCON China 2008 trade show and exhibition, scheduled to take place April 8 to 11, 2008, in Shanghai, China. This high precision bonder provides a placement accuracy of � 0.5 micron.

Finetech

Solder Joint Reliability Under Realistic Service Conditions

Technical Library | 2014-10-30 01:48:43.0

The ultimate life of a microelectronics component is often limited by failure of a solder joint due to crack growth through the laminate under a contact pad (cratering), through the intermetallic bond to the pad, or through the solder itself. Whatever the failure mode proper assessments or even relative comparisons of life in service are not possible based on accelerated testing with fixed amplitudes, or random vibration testing, alone. Effects of thermal cycling enhanced precipitate coarsening on the deformation properties can be accounted for by microstructurally adaptive constitutive relations, but separate effects on the rate of recrystallization lead to a break-down in common damage accumulation laws such as Miner's rule. Isothermal cycling of individual solder joints revealed additional effects of amplitude variations on the deformation properties that cannot currently be accounted for directly. We propose a practical modification to Miner's rule for solder failure to circumvent this problem. Testing of individual solder pads, eliminating effects of the solder properties, still showed variations in cycling amplitude to systematically reduce subsequent acceleration factors for solder pad cratering. General trends, anticipated consequences and remaining research needs are discussed

Universal Instruments Corporation

FINEPLACER® matrix – "The new generation" World premiere at Productronica in Munich

Industry News | 2009-12-07 18:52:26.0

With the FINEPLACER® matrix, Finetech is not only extending its product range, but also pointing the way forward for the product family. The modular thinking behind the FINEPLACER ®s has been further perfected. Depending on the customer's requirements, the platform can be configured either as a high-end rework system or as a high-precision assembly and bonding system. In each case there are two accuracy options available, of 10 µm and 3 µm.

Finetech

Tresky presents metallic sintering for power electronics at productronica 2023

Industry News | 2023-10-30 19:21:14.0

Tresky GmbH from Hennigsdorf near Berlin will present various metallic pre-sintering processes, including the Die Transfer Film (DTF) process, at this year's productronica 2023 in Munich. Especially for bonding semiconductors such as IGBTs, SiC MOSFETs or GaN HEMTs with Ag on DBC or AMB substrates or for connecting power modules on heat sinks, metallic sintering offers a high-performance solution with maximum reliability.

Tresky AG

PDR’s New IR Thermal Test System Thermally Cycles Key Critical Components to Detect Defects

Industry News | 2017-08-16 11:15:46.0

PDR today announced plans to exhibit at SMTA International. The PDR team will showcase the Evolution Series Rework Systems – including the new PDR IR-E3M Micro Component/PCB Rework System – in Booth #233. Additionally, the new PDR IR-TS One IR Thermal Test System will be available for demos.

PDR-America


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