Industry News | 2018-02-19 13:46:00.0
BTU International will demonstrate its TrueFlat technology in the CohPros International Co., Ltd, booth #N2, 2613 at SEMICON China, scheduled to take place March 14-16, 2018 at the Shanghai New International Expo Centre.
Industry News | 2018-02-20 17:53:30.0
BTU International will exhibit at productronica China, scheduled to take place March 16-18, 2018 at the Shanghai New International Expo Centre. The company will showcase the PYRAMAX™ 125N Dual Lane Reflow Oven in Booth # E2, 2120 in the SMT Innovation Area.
Industry News | 2018-09-19 21:04:12.0
BTU International,will exhibit in Booth #430 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. At the show, the company will discuss the latest software version – WINCON™ 7.0. New features of the latest software release include:
Industry News | 2022-12-14 12:30:03.0
BTU International, Inc. is excited to announce the launch of its new profiling technology at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. As a result of the company's strategic partnership with iRaptor, BTU has developed its new iRaptor Profiling Technology that will debut for the first time at the show in Booth #2322.
Industry News | 2023-09-04 14:03:03.0
BTU International, Inc. will highlight its TrueFlat™ reflow oven technology at SEMICON Taiwan in booth #M1039. The expo is scheduled to take place September 6-8, 2023 at TaiNEX 1 & 2 in Taipei.
EP-1100 is a one-part adhesive epoxy designed for screen or stencil printing for component attachment, termination and other applications in: hybrid circuits membrane keypads other electromechanical assemblies EP-1100 exhibits excelle
Tachyon-100G laminate materials are designed for very high-speed digital applications up to and beyond speeds of 100 Gb/s. Tachyon 100-G materials exhibit exceptional electrical properties that are very stable over a broad frequency and temperature
Industry News | 2022-05-18 12:32:37.0
Heraeus Electronics today announced the launch of its new Condura®.ultra Ag free AMB Substrate. A cost-efficient, highly reliable, Ag free AMB substrate that enables bonding silicon-nitride-based ceramics with copper foils, Condura®.ultra was developed using a special technique enabling high-performance Si3N4 substrates by using new, Ag free active metal brazing (AMB) bonding technology.
Industry News | 2014-01-09 10:39:28.0
Engineered Material Systems is pleased to debut its 535-10M-45 UV Cured Epoxy Adhesive formulated for disk drive, camera module, optoelectronic and circuit assembly applications.
Industry News | 2014-03-31 16:21:29.0
Engineered Material Systems debuts its 535-10M-49 UV cured epoxy adhesive formulated for disk drive, camera module, optoelectronic and circuit assembly applications.
