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BICHENG Gold finger PCB

BICHENG Gold finger PCB

Parts & Supplies | Circuit Board Assembly Products

1). FR-4 Material 2). 2 layer, 1.2mm thick 3). 1 oz copper weight. 4). LPI Green solder mask/White silk screen 5). Gold finger 40 microinch, bevelled. 6). HASL + Gold finger, ENIG + gold finger 7). Larg volum, punch contour.

Bicheng Enterprise Company

BICHENG Mixed material PCB

BICHENG Mixed material PCB

Parts & Supplies | Circuit Board Assembly Products

1). FR-4 Tg 170 + Rogers 4350B 2). 290*130mm/1up 3). 6 layers at 1.6mm thick 4). Green solder mask/White ident 5). 35um copper finished, ED copper. 6). Electroless gold. 7). Countersunk slots.

Bicheng Enterprise Company

Bicheng Bicheng via in pad PCB

Bicheng Bicheng via in pad PCB

Parts & Supplies | Circuit Board Assembly Products

1). 80 *190mm/2up, FR-4 2). 6 layers at 1.4mm thick 3). 35 μm copper weight 4). Green solder mask LPI/White legend 5). ENIG surface finish 6). Blind via from Layer 1 to layer 2 7). Via in pad plugged conductive resin

Bicheng Enterprise Company

BICHENG Rigid-flex PCB

BICHENG Rigid-flex PCB

Parts & Supplies | Circuit Board Assembly Products

1). 100*85mm, FR-4 Tg170/ Polyimide 2). 4 layer count rigid/2 layer flex 3). 1.0mm thick rigid/0.15mm thick flex 4). 1 oz each layer 5). Green LPI solder mask/white ident 6). Immersion gold

Bicheng Enterprise Company

Bicheng CSP printed circuits

Bicheng CSP printed circuits

Parts & Supplies | Circuit Board Assembly Products

1). 100mm x 98mm/1up, FR-4, 2). 1mm +/-0.1mm,6 Layers 3). 1oz copper finished 3). Green solder mask/white legend 4). Min. hole 0.15mm, 4/4 mil track/gap 5). Blind via layer 1-2, via-in-pad. 6). Immersion gold surface finish

Bicheng Enterprise Company

BICHENG HDI Printed circuits

BICHENG HDI Printed circuits

Parts & Supplies | Circuit Board Assembly Products

1). 1+C+1 HDI, buried/blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and space 5). Min.drill 0.1mm 6). Green solder mask/ white silkscreen 7). Immersion gold over nickel

Bicheng Enterprise Company

BICHENG Fine-pitch BGA PCB

BICHENG Fine-pitch BGA PCB

Parts & Supplies | Circuit Board Assembly Products

1). 177 x 75mm (2UP), FR-4 Tg 170 2). 1.6mm +/-10%, 6 layer 3). Min. hole 0.15mm, 4/4 track/gap 4). Finished copper weight inner/outer 1 oz 5). Green solder mask/ White ident 6). Immerstion gold. 7). Fine and micro BGA

Bicheng Enterprise Company

4L-ENIG-PCB

4L-ENIG-PCB

New Equipment |  

FR-4 Material 1. 0 mm Thickness 1oz copper thickness 4 Layers HASL Surface Treatment Green Solder Mask e-test

Shenzhen Longkun Technology Co.,Ltd

6-layer-Carbon-Ink-PCB

6-layer-Carbon-Ink-PCB

New Equipment |  

High Tg FR4 Material 2.0 mm Thickness 6 Layers Immersion Gold Surface Treatment Green Solder Mask Carbon Ink

Shenzhen Longkun Technology Co.,Ltd

8-layer PCB with impedance control

8-layer PCB with impedance control

New Equipment | Other

8-layer PCB with impedance control. Surface Finish: Immersion Gold

Pinsheng Group Ltd.


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