Technical Library | 1999-08-27 09:29:49.0
Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective...
Industry News | 2003-04-29 07:30:06.0
Announce their plans to co-sponsor a free online conference on the current state of bare die packaging
Industry News | 2011-01-20 13:54:40.0
IPC will host the IPC Conference on HDI: Strategies for the 21st Century on March 1–2, 2011, at the National Electronics Museum in Baltimore, Md. Sponsored by Northrop Grumman Corporation, the two-day event includes technical workshops on March 1 and a full-day technical conference on March 2.
Industry News | 2023-05-15 17:38:25.0
IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an "On-Shoring Advanced Packaging and Assembly," workshop July 10-12, 2023, in Washington, D.C.
Industry News | 2017-05-10 18:15:53.0
Nordson ASYMTEK and Nordson MARCH, Nordson companies (NASDAQ: NDSN), will present papers at the Conformal Coating Materials and Processes session at the Contamination, Cleaning, and Coating Conference being held in Amsterdam, Netherlands. Transitioning from Manual to Automated Conformal Coating, by Michael Szuch, Nordson ASYMTEK and Optimizing the Plasma Treatment Process Prior to Conformal Coating to Eliminate ESD Induced Failures, by David Foote, Nordson MARCH, will be presented on Wednesday, May 24, 2017.
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Industry News | 2024-02-12 13:44:30.0
In a letter signed by 54 microelectronics executives, IPC and Printed Circuit Board Association of America (PCBAA) are calling on Congress to fully fund the Defense Production Act Purchases Account at the House-passed level of $618 million and $1.08 billion for the Industrial Base Analysis and Sustainment program.
Industry News | 2023-10-23 09:48:49.0
IPC, part of MAPT Roadmap Extended Executive Committee provides data on next generation advanced packaging, materials, substrates, and supply chain future needs
Industry News | 2014-03-27 14:15:48.0
The 9th Annual Medical Electronics Symposium will be held at Marylhurst University near Portland, Oregon, on September 18-19, 2014. SMTA, iNEMI, MEPTEC and OregonBio have joined forces to host this year’s international symposium, which will focus on advances in electronic technologies and advanced manufacturing, specifically targeting medical and bioscience applications.
Industry News | 2009-07-24 14:13:44.0
Minneapolis, MN – The SMTA and MEPTEC are proud to announce the program for their co-organized 2009 Medical Electronics Symposium: Drivers for Technology, Health and the Economy on September 16-17, 2009 at Arizona State University, Tempe, AZ. This two day program will cover a broad spectrum of medical applications with Day 1 focusing primarily on the chip level component packaging and Day 2 focusing on board assembly and systems levels.