Used SMT Equipment | General Purpose Equipment
MODEL : T222 SPECIFICATION : Thermoplactic Material : Pvc ,PP,PS,HIPS,APET,PETG,EVA Materia
Nordson Dage XD7600NT500 X-Ray Inspection System with X-Plane Analysis - Datest was one of the first users of the X-Plane algorithm. We now have 3 years of experience using X-Plane. It is a very powerful tool for detecting head-in-pillow (HiP) de
Open permanent magnet free maintenance 0.25 Tesla field Integrated small surface, system can be installed in a single enclosure 18 m² Low power consumption: less than 3 kW of power output normal 220 / 110V Ergonomic rotating patient table with a
Open permanent magnet free maintenance 0.25 Tesla field Integrated small surface, system can be installed in a single enclosure 18 m² Low power consumption: less than 3 kW of power output normal 220 / 110V Ergonomic rotating patient table with a
New Equipment | SMD Reel Storage
To prevent damage to devices during shipping and storage, loaded carrier tape is typically wound onto a plastic take-up reel. Available in 7", 13", 15" and 22" diameters, Plastlist packaging reel are made from high-impact injection-molded polystyrene
New Equipment | Fabrication Services
Ehren-Haus specilized in fabricating, vacuum forming or thermoforming, bending and machining custom plastic signs such as engraved, clear, layred, outdoor, and custom shaped plastic signs made of acrylic, ABS, HIPS, PETG, Polycarbonate, HDPE, Teflon
In-Line X-ray Inspection System Automatically in-line inspect Solder joint defects of PCBA and other defects on Hidden Components. Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently. Performing X-r
Technical Library | 2009-11-05 11:17:32.0
Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress.
New Equipment | Fabrication Services
Expert in acrylic plastic displays fabrication, machining and forming services. POP (Point-to-Purchase), and POS (Point-to-sale) displays for various industrial application. Some typical materials chosen for displays are: Acrylic: clear, colored, tra
New Equipment | Solder Materials
90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical r