Industry Directory | Distributor
Practical Tools offers brand name products including Scienscope Microscopes and Inspection Equipment, Excelta, Weller, Hakko, 3M, Henkel (Multicore/Loctite/Hysol), Tech Spray, Micro Care, Lindstrom, X
Industry Directory | Distributor
Practical Tools is an authorized distributor of tools and supplies for all types of industries including Bio-Medical Manufacturing & Research, Electronics Assembly, Military and Aerospace Manufacturin
Henkel's diverse portfolio of adhesive and sealant solutions includes advanced materials technologies to address today’s most demanding applications. From electrically conductive and non-conductive paste adhesives through to thermally conductive diel
Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi
Electronics Forum | Wed Apr 08 15:40:20 EDT 2015 | kevinb
I would like to find somebody that uses Hysol, (Loctite) material GR 9810-1P. I would like to see how it molds and see if they could part with some of this material for us to try. We are willing to pay for a trial sample. I can go to Hysol but the
Electronics Forum | Tue Apr 17 09:19:11 EDT 2001 | Terry Burnette
Dave, I use Dexter Hysol epoxy 9340 gray. It's a two part epoxy kit. Thermally conductive and electrically insulative. Cures in about 10 minutes at 100C. Terry
Industry News | 2009-05-26 18:16:29.0
In a remarkable breakthrough for underfill materials development, Henkel has engineered and launched a new underfill system that delivers on an unprecedented array of complex and demanding requirements, including room temperature fast flow, low temperature cure and reworkability. The new material, Hysol� UF3800�, has been specifically designed for use with today's CSP and BGA devices and is particularly well-suited for handheld communication and entertainment applications.
Industry News | 2008-04-17 16:46:07.0
In what is truly a ground breaking material advance, Henkel Corporation has developed a new reflow cured encapsulant material that combines flux functionality and underfill protection into a single material. The breakthough product, Hysol� FF6000�, is a reflow curable material that is formulated to provide flux for lead-free solder joint formation and, when cured, delivers protection against mechanical stress.
Technical Library | 2023-08-16 18:20:44.0
One of our defense customers planned to dispense underfill material for small and large die, using Hysol FP4545FC epoxy encapsulant. This process dissipates stress on solder joints and prevents cracking and fracturing between the bottom of the die and the surface of the substrate.
Printed Circuit Board Protection Methods - Conformal Coating Encapsulants Potting Module Sealing Low Pressure Molding
