ML-A410 SMT Automated Optical Inspection Machine Feature ▶Economical and practical AOI. ▶High precision detection platform design. ▶Fast programming debugging integration. ▶Automatic recognize the Tip and Bottom side. ▶Professional SPC system.
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Used SMT Equipment | SPI / Solder Paste Inspection
KOH YONG/SPI KY8030 2XL MACHINE KY8030-2XL MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square, irregular polygon, circle)/volume/spacing (X, Y axis)/angle
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Industry Directory | Manufacturer
Manufacturer of automated production systems;PCB magazine loader,PCB separator,PCB cutting machine,PCB unloaders, PCB conveyors,PCB depaneling machines,PCB turn conveyors,PCB conformal coaters,PCB solder paste printer,PCB buffer
Used SMT Equipment | AOI / Automated Optical Inspection
SAKI Desktop AOI BF18D-P40 Inspection Machine Substrate flatness: ±2mm Board size:50 * 60 - 250 * 330mm PCB thickness: 0.6mm - 2.5mm weight::30KG ■ Industry-Leading High Throughput Leading High Throughput The Alternate Color Digital Scanning
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Events Calendar | Thu Apr 30 00:00:00 EDT 2020 - Thu Apr 30 00:00:00 EDT 2020 | ,
Screen Printing Key Factors
Used SMT Equipment | AOI / Automated Optical Inspection
YAMAHA AOI YSi-V MACHINE KLT-000 1. Model: Yamaha ysi-v 2. Target substrate: l610 x w560 (maximum) ~ l50 x w50 (minimum) & supports l750mm super long substrate (optional) 3. Resolution: visible light (red/green/blue) & infrared (infra-
Used SMT Equipment | SPI / Solder Paste Inspection
Solder paste thickness detector Measurement software: MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square Shape, irregular polygon, circle) / volume / spacin
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