Electronics Forum | Mon Jan 07 20:37:15 EST 2002 | davef
For soldered areas, we like to keep gold thickness substantially below the maximum you propose. Search the fine SMTnet Archives for our discussions on the topic of acceptable levels of gold with solder connections. Let�s fix this �no one seems be s
Electronics Forum | Wed Sep 18 22:53:24 EDT 2002 | davef
Please give us background on your situation, so that we can focus on the specifics, for instance: * This is a bare board problem, correct? Then, this contamination causes what the problems in your process? * What is the type [ie, FR4, CEM1, etc] of
Electronics Forum | Wed Feb 03 23:40:26 EST 1999 | Chris G.
| Does anyone know if I will have problems soldering surface mount components to an all hard gold plated PC board. We want to use hard gold similar to gold used for edge fingers because our customer is concerned about wear and conductivity of connect
Electronics Forum | Wed Feb 03 18:36:47 EST 1999 | Earl Moon
| Does anyone know if I will have problems soldering surface mount components to an all hard gold plated PC board. We want to use hard gold similar to gold used for edge fingers because our customer is concerned about wear and conductivity of connect
Electronics Forum | Mon Oct 24 05:43:52 EDT 2016 | zxcvb
I have many PCBs that use an AVR in SMD packaging, and since I frequently change the firmware in prototype boards, I'm trying to come with the best solution to program the AVR quickly and easily. The first approach was to have a standard header (2x5
Electronics Forum | Tue Sep 05 05:25:27 EDT 2017 | heros_electronics
Hi, I think your friend wrongly changed the D code so that the finger width doesn't meet your requirements. And the fingers have long and short ones, which is hard to do selective gold plating because of not easy to add plating wires. Of course, you
Electronics Forum | Fri Sep 01 15:52:03 EDT 2017 | wyluliwolf
Long story short: I paid someone to convert some older Gerber files to the new RS-274x format for me so I could have them manufactured. I sent them the original Gerber files (RS-274D) along with additional files showing information on the layout. T
Electronics Forum | Thu Jan 09 15:19:41 EST 2014 | davef
For a typical wear surface application [millions of wipes], I agree with hege. You need to be talking electrolytic gold, NOT immersion gold. IPC-2221 says something like ... For edge connectors and areas not to be soldered: * Nickel - 2.5um [~100uin]
Electronics Forum | Tue Nov 07 21:49:05 EST 2000 | Dave F
Cheers to you Your gold plating is specified for the gold wire bonding between the die of your BGA and the pads on the BGA substrate. For solderable surfaces this is heavy on gold for use on pads. Gold SB thinner on pads to limit the amount of gol
Electronics Forum | Tue Jun 04 17:10:13 EDT 2002 | davef
First, �flash gold� is very loose language. It means different things to different people. �Flash� gold is a thin coat of immersion gold. Imm gold self-limits at ~0.3um[12uin]. And fabs put-down �flash� prior to electroplating thicker gold for wi
