Electronics Forum | Thu May 10 19:19:41 EDT 2007 | rgduval
Wayne, I haven't seen anything indicating that Gold Immersion is necessary for lead free... However, it is my companies preferred finish for lead free assemblies. We've taken this stance for the following reasons: 1. Better solder quality on th
Electronics Forum | Thu Dec 21 15:58:49 EST 2000 | Josue Jacquez
Hi Guys! I'm looking for information regarding the Tin immersion process. Is somebody there with such info? Could you send me or explain me the process? I'll appreciate your help.
Electronics Forum | Thu Dec 21 15:57:36 EST 2000 | Josue Jacquez
Hi Guys! I'm looking for information regarding the Tin immersion process. Is somebody there with such info? Could you send me or explain me the process? I'll appreciate your help.
Electronics Forum | Tue Mar 01 10:21:55 EST 2005 | davef
IPC Plating Committee is presently working on a specification for immersion tin [IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards] as a solderable surface finish. Immersion tin is normally deposited at 30 to 60 microinches.
Electronics Forum | Sat Mar 05 22:44:44 EST 2005 | gpaelmo
You can also try the Florida Circtech website or call them direct. There is a min. thickness requirement and if the board house does not follow it you will end up with scrap boards after the second pass (from experience). I even sent blank boards to
Electronics Forum | Fri Dec 16 13:31:03 EST 2005 | gpaelmo
Thanks for your response.
Electronics Forum | Fri Dec 16 13:31:28 EST 2005 | gpaelmo
Thanks for your response.
Electronics Forum | Fri Dec 16 08:16:41 EST 2005 | davef
Heat cycles deplete the pure tin layer. Each solder cycle reduces the tin thickness by ~0.1 micron (4 uin). So, if you start with a thin imm tin coating you'll have problems after multiple heat cycles. Steve Wentz says, "In almost every case I've
Electronics Forum | Fri Dec 16 03:47:46 EST 2005 | gpaelmo
Anyone have problems wave soldering white tin finish? We are an ems and our customer provides us the pcb's. SMT and TH components on the board. SMT is fine but when we wave solder, wetting to top side is very poor (solder only flows half way up). We
Electronics Forum | Fri Dec 16 08:00:26 EST 2005 | jax
What you are most likely dealing with: Insufficient Pure Sn layer ( multiple causes ) Because elevated temperatures accelerate the diffusion process, the thickness of the Pure Sn layer will reduce during every thermal cycle... ( bakeing PCBs, S
