Electronics Forum | Mon Nov 25 15:55:32 EST 2002 | davef
Sorry, no tricks for you. The good news is: your reflow recipe should be similar for both imm tin and HASL. Imm tin requires more attention to detail by both the fabricator and the assembler than HASL. There is a fair amount of discussion on imm
Electronics Forum | Mon Nov 25 09:06:15 EST 2002 | jax
You might want to check the tin thickness. I believe you have a minimum of .65 microns in order to achieve a good solder joint through 3 thermal passes. In an immersion tin process, the ability to solder is time and temperature dependant. As the int
Electronics Forum | Mon Nov 25 16:12:52 EST 2002 | russ
there is a good article by AIM solder regarding tin. In a nut shell, if you do not apply flux or heat to tin finish you will never degrade it! I agree with the others that you need to check the thickness of the pure tin layer. We have forbidden ti
Electronics Forum | Thu Dec 21 20:09:01 EST 2000 | Dave F
You are one lucky person to have access to the fine SMTnet Archives. They have over a hundred threads on immersion tin, white tin, and the other variants.
Electronics Forum | Thu May 10 19:19:41 EDT 2007 | rgduval
Wayne, I haven't seen anything indicating that Gold Immersion is necessary for lead free... However, it is my companies preferred finish for lead free assemblies. We've taken this stance for the following reasons: 1. Better solder quality on th
Electronics Forum | Thu Dec 21 15:58:49 EST 2000 | Josue Jacquez
Hi Guys! I'm looking for information regarding the Tin immersion process. Is somebody there with such info? Could you send me or explain me the process? I'll appreciate your help.
Electronics Forum | Thu Dec 21 15:57:36 EST 2000 | Josue Jacquez
Hi Guys! I'm looking for information regarding the Tin immersion process. Is somebody there with such info? Could you send me or explain me the process? I'll appreciate your help.
Electronics Forum | Tue Mar 01 10:21:55 EST 2005 | davef
IPC Plating Committee is presently working on a specification for immersion tin [IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards] as a solderable surface finish. Immersion tin is normally deposited at 30 to 60 microinches.
Electronics Forum | Sat Mar 05 22:44:44 EST 2005 | gpaelmo
You can also try the Florida Circtech website or call them direct. There is a min. thickness requirement and if the board house does not follow it you will end up with scrap boards after the second pass (from experience). I even sent blank boards to
Electronics Forum | Fri Dec 16 13:31:03 EST 2005 | gpaelmo
Thanks for your response.
