Industry News | 2007-04-04 16:03:30.0
04/04/2007
Industry News | 2013-11-01 13:11:17.0
Indium Corporation's new SACM™ is a high-reliability solder alloy that offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling – all at a cost below that of typical SAC solder alloys.
Industry News | 2020-08-22 04:07:55.0
Indium Corporation will host an InSIDER Series webinar on causes and solutions of PCB and component warpage defects, presented by industry consultant Bob Willis. There will be two sessions on Wednesday, Sept. 9--5:30 a.m. Eastern Time (10:30 a.m. London Time, 5:30 p.m. Malaysia Time) and Noon Eastern Time (5 p.m. London Time, Midnight Malaysia Time).
Industry News | 2020-11-03 13:15:31.0
Indium Corporation and RENEX Group have formed a strategic partnership for the service of their PCB and engineered solder materials in Poland.
Industry News | 2019-02-06 08:37:42.0
Indium Corporation has released Indium6.6HF Solder Paste – a new water-soluble solder paste that is compatible with both SnPb and Pb-free alloys. Indium6.6HF is designed to provide exceptional stencil printing performance and minimize voiding in PCB assembly applications.
Industry News | 2021-10-28 11:50:17.0
Indium Corporation's Product Development Specialist Miloš Lazić will share his industry knowledge on thermal interface materials (TIMs) at PCB Carolina on Nov. 10 in Raleigh, N.C., USA.
Industry News | 2014-04-30 13:42:31.0
Indium Corporation's Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.
Industry News | 2008-02-28 15:03:16.0
Indium8.9 Pb-Free Solder Paste is an air reflow no-clean solder paste that prints perfectly every time.
Industry News | 2022-07-31 19:44:07.0
Indium Corporation earned Electronics Manufacturing (EM) World's Innovation Award for Indium12.8HF, a versatile solder paste engineered to deliver exceptional jetting and microdispensing performance on a variety of systems.
Industry News | 2016-04-21 19:00:55.0
Indium Corporation's Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will present at the International Conference on Soldering and Reliability (ICSR) 2016 on May 9-11 in Toronto, Canada. Sandy-Smith will present How Stencil Design and Reflow Profiles Affect Variation in QFN Voiding Data: A Case Study. This presentation will include data from several studies that demonstrate how stencil design and reflow profile optimization impacts voiding levels and variation in material comparison testing.
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