Technical Library | 2011-06-16 18:59:43.0
Based on tests carried out with commercially available chemistry, this paper discusses the advantages available through the use of NEAP processes for inner layer bonding and soldermask pretreatment. The process is characterized with a view to high volume
Events Calendar | Tue Jan 23 00:00:00 EST 2018 - Tue Jan 23 00:00:00 EST 2018 | New Milford, Connecticut USA
FREE Webinar: Eliminate Circuit Board Problems and Failure Modes
Parts & Supplies | Component Packaging
ES19101 ESD shielding bag ESD Shielding bags can utmostly protect sensitive components from potential static damage. Their special 4 layers structure forms an induction hood effect to isolate the inside items from electrostatic field. Besides, the
Technical Library | 2011-10-06 13:59:04.0
The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (stacked dies, embedded packaged components). Many companies in the high-end consumer electronics market place have been embedding passive chip components on inner PCB and IC Packages for a few years now. However, embedding packaged components on inner layers has remained elusive for the broader market due to lack of proper design tools and high cost of embedding components on inner layers (...) This paper will highlight several key industrialization aspects addressed in the frame of the European funded FP7 HERMES* project to build a manufacturing environment for products with embedded components. The program entered its third year and is now dealing with the manufacturing of functional demonstrators as an introduction to industrialization.
Industry News | 2019-05-16 01:24:13.0
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development trend. The application of the resin plugging process has also become more and more extensive, and it has been used in HDI panels.
New Equipment | Rework & Repair Services
MLT provides laser rework services for PCB's including pad / component isolation and trace cutting. Contacts, pads, or other metal features can be laser defined or redimensioned without plunging into the dielectrics below. Trace cuts can be on the
Cavity boards are multilayer designs that expose inner layers to air by requiring pockets of material to be cut out. This requires laminating precut materials, controlled-depth fabrication, tight processing controls, and manufacturing versatility. Al
Parts & Supplies | Tape and Reel
Product Description Pressure sensitive adhesive designed to adhere to both polystyrene and polycarbonate carrier tapes Excellent clarity Ultra smooth peel back Static dissipative on inner and outer layers All splice tape
2929 bondply is an unreinforced hydrocarbon based thin film adhesive system intended for use in high performance, high reliability multi-layer constructions. A low dielectric constant (2.9) and loss tangent ( 2929 bondply is compatible with tradit
Industry Directory | Manufacturer
Auspi Enterprises Co., Ltd., one of the professional suppliers of printed circuits in China. We found your company info on the web knowing that you're dealing with electronics, which we think you may have demand on pcbs.
