New Equipment | Cable & Wire Harness Equipment
Application: Aluminum tube NTC thermistor temperature sensor probe assembly for coffee maker, cookie maker, bread maker, roaster, toaster and other food processing, especially for coffee maker heating tray, bake tray. Resistance @200C R
Technical Library | 1999-05-07 08:50:40.0
To enable transistor scaling into the 21st century, new solutions such as high dielectric constaConventional scaling of gate oxide thickness, source/drain extension (SDE), junction depths, and gate lengths have enabled MOS gate dimensions to be reduced from 10mm in the 1970’s to a present day size of 0.1mm. To enable transistor scaling into the 21st century, new solutions such as high dielectric constant materials for gate insulation and shallow, ultra low resistivity junctions need to be developed. In this paper, for the first time, key scaling limits are quantified for MOS transistorsnt materials for gate insulation and shallow, ultra low resistivity junctions need to be developed.
Industry Directory | Manufacturer
Supplier of high quality engineered materials, including conductive and resistive inks, UV curable dielectrics and insulators, adhesives, coatings, transducer inks and potting compounds.
Specifications: Features: As well as applications to small sized electronic apparatus, This series is designed for easy handing and is available with A variety of adjustment method (top, bottom, side and double sides). Wide mounting sizes and ty
Specifications: Features As well as applications to small sized electronic apparatus, This series is designed for easy handing and is available with A variety of adjustment method (top, bottom, side and double sides). Wide mounting sizes and typ
Specifications: Features As well as applications to small sized electronic apparatus, This series is designed for easy handing and is available with A variety of adjustment method (top, bottom, side and double sides). Wide mounting sizes and typ
New Equipment | Test Equipment
Key Features and Specifications Measurement of Real, Imaginary and Total Current Ground Fault Interruption (GFI) for operator safety Programmable Ramp, Test and Fall Times Storage of Tests Setups, 25 User (5 predefined), and 9 Mu
New Equipment | Test Equipment
Performs GPIB interfacing between computer/controllers and ROD-L Hipot, Ground Continuity and Insulation Resistance Testers Remove manual operators from the electrical safety test process to ensure maximum test consistency ad the minimize operator
Technical Library | 2023-04-17 17:05:47.0
In an ideal world, manufacturing devices would work all of the time, however, every company receives customer returns for a variety of reasons. If these returned parts contributed to a fail, most companies will perform failure analysis (FA) on the returned parts to determine the root cause of the failure. Failure can occur for a multitude of reasons, for example: wear out, fatigue, design issues, manufacturing flaw or defect. This information is then used to improve the overall quality of the product and prevent reoccurrence. If no defect is found, it is possible that in fact the product has no defect. On the other hand, the defect could be elusive and the FA techniques insufficient to detect said deficiency. No-clean flux residues can cause intermittent or elusive, hard to find defects. In an attempt to understand the effects of no-clean flux residues from the secondary soldering and cleaning processes, a matrix of varying process and cleaning operation was investigated. Of special interest, traveling flux residues and entrapped residues were examined, as well as localized and batch cleaning processes. Various techniques were employed to test the remaining residues in order to assess their propensity to cause a latent failure. These techniques include Surface Insulation Resistance1 (SIR) testing at 40⁰C/90% RH, 5 VDC bias along with C32 testing and Ion Exchange Chromatography (IC). These techniques facilitate the assessment of the capillary effect the tight spacing these component structures have when flux residues are present. It is expected that dendritic shorting and measurable current leakage will occur, indicating a failing SIR test. However, since the residue resides under the discrete components, there will be no visual evidence of dendritic growth or metal migration.
Parts & Supplies | X-Ray Inspection
CT81 HV Disc Ceramic Capacitor 2KV~50KV, 10pf~50000pf CT81 High Voltage Disc Ceramic Capacitor, High Voltage Disk Ceramic Capacitor, HV disc ceramic capacitor, 20KV radial disc ceramic capacitor, 30kv axial ceramic capacitor, 50kv axial disc ceramic
.gif)
