Electronics Forum | Tue Apr 03 22:03:18 EDT 2001 | davef
With friends like you, who needs enemies? I�d guess that the perceived benefits of flat pads for your 20 mil pitch and below components counter-balance the higher cost, gold being a solder pot contaminant, limited solder mask compatibility, potentia
Electronics Forum | Fri Feb 19 14:44:24 EST 1999 | Lance A. Smalley
You don't say what kind of machine you are using but several just use the edge of fiducials to determine area (and centers). If you are teaching in binary and have the ability to select a decision level (threshold), use a level half way between loss
Electronics Forum | Tue Aug 26 15:39:49 EDT 2008 | kpm135
I am not positive about this but I have been told that you cannot use acrylic and urethane coatings in systems that have had silicone run through them. It was explained to me that you can never fully get the silicone out of the existing system and th
Electronics Forum | Mon Sep 27 08:52:11 EDT 1999 | Brian
| i had a problem here, during the wave soldering process, we apply a water soluble mask on the gold finger to protect it from contamination. But after washing, there is still some mask left on the gold finger. | Can anyone pls advise is there any pa
Electronics Forum | Tue Dec 01 13:53:12 EST 1998 | Brian Conner
| | | | | | All y'll: I could use your input on determining when to skim dross from a wave solder pot. | | | | | | | | | | | | On one hand, dross protects the surface of the solder from oxidation. On the other hand too much dross may affect solder
Electronics Forum | Wed Dec 02 09:03:34 EST 1998 | Dave F
| | | | | | | All y'll: I could use your input on determining when to skim dross from a wave solder pot. | | | | | | | | | | | | | | On one hand, dross protects the surface of the solder from oxidation. On the other hand too much dross may affect
Electronics Forum | Fri Apr 10 20:35:59 EDT 1998 | Steve Gregory
| | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no problem. T
Electronics Forum | Mon Apr 13 08:42:32 EDT 1998 | Bob Silveri
| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble
Electronics Forum | Fri May 28 16:30:39 EDT 1999 | JohnW
| Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. | | Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect
Electronics Forum | Mon Mar 29 18:17:48 EST 2004 | kerryn
It should be noted that some of the main reasons to change from manual cleaning to automated stencil cleaning are: � Manual cleaning is not consistent � quality is totally in the operators hands � Contamination left on the stencil and in the aperture
