Electronics Forum | Wed Jun 12 11:26:50 EDT 2002 | pjc
Sean, Have you contacted Speedline Technologies applications enegineers? They have a lot of knowledge about SPOTT working with customers over the years to develop the process. I myself have experience doing SPOTT. I used Fuji GSP2 printers with overs
Electronics Forum | Mon Oct 13 12:28:11 EDT 2003 | Andrea
Up until this point, my company has been hand soldering all of our assemblies. We are a high reliability manufacturer and work to the IPC-610 Class three/ target. We just received a Reflow Solder Batch Oven. It is a small oven, a Gold-Flow GF-B. I ha
Electronics Forum | Mon Sep 26 12:58:33 EDT 2011 | action_101
So you are saying that building to class III is going to prevent failures? I disagree. Class III is trying to hit target condition in every aspect of the production of the circuit board. That my friend does not ensure failures from happening. I see
Electronics Forum | Wed Aug 21 09:09:50 EDT 2013 | wcheew
I am having solder barrel fill issues on THM component, we follow, we follow IPC 610 E requirement. The barrel fill issues happen on signal & ground pin at connector & E-cap. I found out that most of the insufficient solder happen on the connector ag
Electronics Forum | Mon Mar 07 08:03:14 EST 2005 | jonathanpaul
Have any of you ever experienced minor eruptions in your solder bath while it is heating up? Our solder bath splashes solder while it's heating. Once the bath is molten, it no longer does. Can anyone suggest a cause?
Electronics Forum | Wed Apr 29 01:38:38 EDT 2009 | nibirta
already did this test. No solder balls. i have printed the pads without the component. No solder balls. Only with the component. The problem is, it splashing the around components. solder balls wew found on the body of a connector and on top of it. T
Electronics Forum | Sat Jul 25 08:47:25 EDT 2009 | davef
Both "moisture content of bare board" and the "thickness of the copper plating in the PTH" are related to each other. As you heat the solder connection, moisture in the board boils and out-gasses through the solder connection. Plating with the proper
Electronics Forum | Thu Feb 10 11:40:25 EST 2005 | Carol
Hello All, Can somebody direct me to a facility or school or even a business that can offer an x-ray course for Class 3 electronic circuit board population interpretation, as in BGA ball acceptance, connector solderability fill acceptance etc.? Some
Electronics Forum | Wed Jun 17 16:02:09 EDT 2009 | mhunter
Any thoughts on this will be appreciated, thanks in advance for reviewing. This assembly has been processed in our facility by going through a press operation (~ 1731 lbs), then into wave solder. Note the discoloration around the pemnut. The discol
Electronics Forum | Thu Dec 28 16:20:12 EST 2017 | rgduval
Pictures of your issues would help us to help you. Pin holes/blow holes are generally caused by either moisture or flux volatiles/organics. Since you've virtually eliminated moisture, it might be time to look at your paste/flux. You can call eithe
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