Industry News | 2021-11-22 12:14:16.0
Pulsar solderability test system determines how well molten solder will wet on solderable surfaces of electronic components.
Used SMT Equipment | AOI / Automated Optical Inspection
Agilent SJ50 Series 2 AOI Inspection Unit AUCTION ITEM - www.xlineassets.com Auction Item - www.xlineassets.com Also Available: Fuji CP643E Chipshooter Fuji CP65 Chipshooter Fuji IP3 Flexible Placer Vitronics XPM2 Reflow Ove
Industry Directory | Consultant / Service Provider / Training Provider
Consulting in Process and Manufacturing Engineering. Equipment repair and remote troubleshooting on various equipment types and manufacturers. Training remote and on-site on many types of equipment and processes.
Industry Directory | Consultant / Service Provider / Manufacturer
Manufacturer of robotic soldering equipment including contact, laser and ultrasonic soldering available in several robotic platforms including desktop, SCARA, cartesian and six axis multi-articulated robots.
New Equipment | Soldering Robots
Highly Flexible In Insertion Angles. Vertical inline soldering robot, UNIX-700FV is an ideal for irregularly shaped works into which is hard to insert the tip. The vertical multi-joint is utilized to freely change the head angle and quick operation.
Industry Directory | Consultant / Service Provider / Manufacturer
Indianapolis-based PCB Sales & Supply Chain Management, PCB/PCBA Lab Services. Technical Experts who can actually assist you with board issues. Rapid Prototype Assembly to production standards.
Technical Library | 2017-05-25 17:07:39.0
Purpose of this research is to identify the factors that directly influence the effectiveness of the fluxing process in selective soldering machines, using the design of experiment methodology with associated factors and levels used in the experiment. Final findings gives directions for set up of the optimal fluxing parameters that will enable appropriate flux appliance and to gain reduction of soldering quality issues which foundations are from this process.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
The objective of this course is to identify the technical issues in Through hole, SMT, BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of mixed assembly electronics products. The course mat
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
