JUKI JM-100 Hybrid Placement Machine Board size 410×360mmComponent Size: 0603～50mmPlacement Speed:16,000CPHPCB Weight max.4kgProduct description: JUKI JM-100 Multi Task Platform Hybrid Placement Machine, Board size 410×360mm, Component Size: 0603～50
Electronics Forum | Sun Mar 05 13:56:43 EST 2023 | kirill
What you're using is IS - Intelligent solutions... What I have is - JaNets I also have it in my program, but its not working.
Electronics Forum | Thu Feb 09 20:43:26 EST 2023 | ccouture
What is the machine brand and model?
Used SMT Equipment | Chipshooters / Chip Mounters
SMT Insertion machine JUKI Multi task Platform JM-100 Features▶Best in class speed.▶Component insertion time down to 0.6 seconds for vacuum nozzle and 0.8 seconds for gripper nozzle.▶New “Takumi head” with multiple recognition heights▶Component Feedi
Industry News | 2002-03-27 09:42:31.0
Glenn Woodhouse and Janet Semmens were named winners of the Best of Conference Awards
Industry News | 2003-04-17 11:35:44.0
Honored for their contributions to IPC and the electronics industry
Technical Library | 2016-03-03 17:25:26.0
This paper discusses a nano copper based paste for use in via filling. The company manufactures nano copper and disperses the coated nano copper into a paste in combination with micron copper. The resultant paste is injected or fills a via. The via is subsequently sintered by means of photonic sintering, or by heat in a reducing environment. The process will be accomplished in under an hour and results in filled solid copper vias.
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
SMTnet Express, March 3, 2016, Subscribers: 24,124, Companies: 15,000, Users: 40,059 Nanocopper Based Paste for Solid Copper Via Fill David Ciufo, Sujatha Ramanujan, Janet Heyen, Michael Carmody; Intrinsiq Materials , Sunny Patel; Candor
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