Electronics Forum | Tue Jun 07 10:38:34 EDT 2011 | davef
Boots: Here's several methods for guessing at the amount of solder on your connection: * First, 'Down & Dirty' ** Assume that the solder is flat, which is reasonable since it's 'flattened' by the component package ** Assume 100% paste transfer from t
Electronics Forum | Wed May 08 23:18:58 EDT 2002 | ianchan
Hi mates, have this SMT production issue : A) We have a leadless-chip-carrier(LCC) IC package that is classified under the Land-Grid-Array(LGA) package family. B) The LCC is 4mm x 4mm, and has 28 tin plated pads located beneath the outside perimet
Electronics Forum | Tue Jun 07 08:31:57 EDT 2011 | bootstrap
I am building a rugged digital video camera product that essentially is just a sandwitch of 3 parts: #1: front piece is machined aluminum with C-mount thread #2: middle piece is 1/16" printed circuit board #3: back piece is machined aluminum The
Electronics Forum | Wed Mar 20 00:55:01 EST 2002 | ianchan
Heyz...at this rate i'am losing my mind too! We have been doing the "looks good; look bad" approach, and backed it all up with Z-height paste measurements. Only thing there's this customer QA asking how we established those USL & LSL utilized in our
Electronics Forum | Wed Jan 30 16:12:53 EST 2008 | dphilbrick
Process, process, process. We have been doing BGA's, uBGA's, LCC's etc for over 10 years. We have no X-ray and we don't even have a real rework station. In 2005 we placed just under 100,000 BGA's we reworked less than 100, we scrapped less than 30. W
Electronics Forum | Sat Apr 25 19:40:01 EDT 1998 | Stan Traxler
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components We have appl
