Electronics Forum | Mon May 14 13:33:36 EDT 2007 | jax
Solderability!!! The CM in question has probably seen too many solder problems with White Tin in the past. We have had the same issues. To save us from spending too much time and money(verifying pure Tin plating thickness, Chemical leaching from th
Electronics Forum | Tue Apr 14 17:39:34 EDT 2009 | gregoryyork
Sorry been away for a while. It is actually due to high boiling solvents or plasticizers leaching from the porous resist that kills the cure as it puddles out and has nothing to adhere to. We do have some wipes to check the cure and are looking to ma
Electronics Forum | Tue Jun 15 22:31:06 EDT 2010 | Mag10
Depending on the how you plug the via, the void level can significantly affected. If you have via plugged from the bottom side; i.e. opposite side of the component, you will see alot of void due to entrapped air in the via hole. I found work best wh
Electronics Forum | Tue Nov 30 18:02:45 EST 2010 | flipit
62/36/2 is used often in thickfilm hybrid circuits where Pd/Ag conductors are used. The idea is that you saturate the joint with the 2% silver and thus help eliminate the leaching of the silver from the hybrid circuit pads or the component. We mix
Electronics Forum | Wed Dec 04 12:57:01 EST 2013 | markhoch
Thank you for your reply Chris We have the same exact unit. But we've had issues with the cleaning solution leaching into the electrical cabinet and shorting out the PLC. They use a foam weather strip as the only insulation, and the cleaning solutio
Electronics Forum | Thu May 06 19:21:24 EDT 2021 | markhoch
Verify your aperture reductions in the stencil. Are the solderballs always in the same location? Same size & shape? Is the solder leaching through plated thermal holes from the opposite side of the PCB? Are you using stencil apertures designed to min
Electronics Forum | Thu Mar 25 02:22:32 EST 1999 | P.L. Sorenson - Technical Consultant
| | | Your problem may be related to silver migration (leaching) into the solder. I had what seems to be a similar problem. The solution was using solder with 2% silver content. See these pages for a bit more information: | | | | http://www.ferr
Electronics Forum | Tue May 30 08:46:10 EDT 2006 | patrickbruneel
Interesting read, I guess they finally figured it out (with 32 days left) 2 quotes from the articles "What is surprising however � although it should not be � is that, despite the claims of health and environmental threats, the latter based on the r
Electronics Forum | Fri May 07 00:52:24 EDT 2010 | boardhouse
Hi Derek, just curious of one thing - are the vias within the BGA's the only vias covered or are all vias on the board covered. Just trying to figure out what is making this area different from the rest of the board. Regarding leaching, I do not be
Electronics Forum | Tue Jul 04 16:13:09 EDT 2000 | TOOLMANTIM
HELLO BILL I HAVE SOME QUESTIONS FOR YOU 1:HOW ARE YOU CLEANING YOUR STENCIL 2:ARE YOU SINGLE OR DOUBLE PRINTING. 3:ARE YOU USEING VACUUM FIXTURES OR NOT? HERE ARE SOME OTHER THINGS TO TRY. IF YOU ARE CLEANING YOUR STENCIL OFTEN BECAREFUL OF USEING
