Electronics Forum | Tue Nov 27 14:56:33 EST 2007 | jaimebc
Shy, What is your current method of applying adhesive? If the terminals of the component that has adhesive are not wetting ( or not forming a solder joint I think we are talking about ) after reflow, then you must be applying too much adhesive. As
Electronics Forum | Sat Aug 01 01:37:07 EDT 2009 | abhinavajmera
I have been working on Pb-free assemblies of screw terminals (terminal blocks). Unlike, other pin-in-paste conducive components, these component has square headed leads. We have been facing issues with the solder dripping into the oven. We were able
Electronics Forum | Wed Apr 01 02:19:10 EST 1998 | Eldon Sanders
Yes, norm it is. Look back to February 98 discussion on this issue.
Electronics Forum | Mon Nov 26 20:11:41 EST 2007 | shy
Yes, i'm agree with you davef but i'm not put the chipbonders onto pads. i'm put the chipbonders at the beneath component (center between both component terminals) which the idea is to hold the component during wave soldering which might cause the co
Electronics Forum | Fri May 11 07:38:14 EDT 2007 | tombr
It is possible to vary the length of lead during auto insert. However, it requires software and mechanical adjustments. Universal equipment allows small changes via software program for lead length. To change angle of clinch involves a mechanical a
Electronics Forum | Wed Nov 28 01:07:36 EST 2007 | shy
is there any standard gap between the terminal and pad if we place the glue? SMT-4 mention as per what you understand which is using glue at SMT without solder paste and run at wave solder for the solder paste at the terminal. Glue supplier recomm
Electronics Forum | Mon Aug 03 15:04:03 EDT 2009 | davef
We know nothing about your: * Solder alloy * Materials of your board * Materials of your teminal block * Process setup of your wave * Wetting condition of the board or the terminal block ... but we'll take a guess anyhow. Tin-copper based solder all
Electronics Forum | Tue Nov 27 07:51:21 EST 2007 | shy
is there any gap between the pad and terminal if we place the glue? Btw, my practice to print solder pate then punch glue then PNP component and finally reflow. Also we find drop/missing chip after wave eventhough we glue the component.
Electronics Forum | Tue Nov 27 08:21:43 EST 2007 | shy
How many mils the gap between the terminal and pad? Your practice is for technology SMT-4? What is problem with glue cure? is it due to the reflow profile? how long the glue can be keep in room temperature with humidity 40-60?
Electronics Forum | Wed Aug 26 20:58:52 EDT 2009 | mika
Hi, Just as DaveF said; please give us some more information. It could be a a´lot of things. For .ex. Do you by any chances solder with Ni/Au at the board?
