New Equipment | Solder Materials
AMTECH’s Tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. TFs are used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and mBGA packages. Operations such as soldering Flip Chip components t
SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a
Electronics Forum | Mon Jan 29 10:41:10 EST 2007 | davef
Many high rel assemblers reball their LF BGA with SnPb balls. In other less demanding environments, SnPb paste with LF BGA produces acceptable reliability.
Electronics Forum | Wed Oct 05 14:23:50 EDT 2005 | chunks
What kind of destructive testing is anyone doing for LF BGAs?
Industry News | 2009-06-02 14:13:36.0
With the majority of the electronics industry fully on board with lead-free manufacturing, solder paste materials requirements are now moving beyond basic functionality and toward more advanced, truly enabling capabilities.
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: JUKI Part Name: Hard Disk Part Number: 40047579 Machine: FX3 Machine Condition: New Origin: China 40047579 FX3 HDD ASM JUKI Hard Disk with software For JUKI FX3 Machine Detail Information: 1, Part Name: H
Parts & Supplies | Pick and Place/Feeders
JUKI 750 MOTOR ENCODER TRUNK CABLE E93367250A0 Best Quality & Lower price More than we can offer: 40000631 CABLE SAFETY B 40000746 CABLE CLAMP X 40001255 SENSOR CABLE GUIDE 50 40001261 SENSOR CABLE GUIDE 60 40001306 CABLE PROTECT SHEET 4
TI New and Original TMS320LF2406APZS in Stock IC LQFP-100 21+ package TMS320LF2406APZS Digital Signal Processors and Controllers - DSP, DSC 16-Bit Fixed-Pt DSP with Flash TMS5700714APGEQQ1 LQFP-144 TI 22+ MC33079DR2G SOP-14 ON 22+ TPS65217DRS
TI New and Original TPS24712DGSR in Stock IC MSOP10 , 15+ package TPS24712DGSR 2.5V to 18V Hot-Swap Controller with Power Limit, Soft-Start Support Today's Hot Deals： NVMFS4C03NT1G DFN8 ON/ 18+ EPM570M100I5N BGA ALTERA 17+/18+13+ TPS24712
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/page/181?order=list_price+asc
¥ 0.00 0.0 CNY HDF Nozzle 1D 2012 ¥ 0.00 0.0 CNY BGA Rework Station ¥ 0.00 0.0 CNY vaccum pump ¥ 0.00 0.0 CNY Fiber Cable ¥ 0.00 0.0 CNY Fiber Coupler
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/bondtesters/4000-multipurpose-bondtester
. Additional options include Cold Bump Pull , Vectored Pull for micro BGA, and automatic testing for small geometry packages Internal SPC software to provide basic analysis Fully ODBC compatible to exchange data with external Statistical Process Control systems
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