Industry News | 2012-07-12 10:34:54.0
The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
Industry News | 2003-02-07 08:40:55.0
The Industry's Most Invaluable Tool for Quality Assurance and Assembly Departments is Now Available in Japanese, German, Czech and Danish
Industry News | 2003-05-15 08:02:52.0
IPC announces the release of two newly revised standards on solderability
Industry News | 2003-06-19 08:08:23.0
Release of three new documents highlighting the latest technology developments divulged at recent IPC international conferences.
Industry News | 2003-07-09 09:11:37.0
Release of the first revision to the standard that forms the foundation of IPC�s family of design standards (IPC-2220)
Industry News | 2010-10-06 14:44:35.0
Helping electronics manufacturing companies train their staff to enhance product quality and increase efficiency, IPC — Association Connecting Electronics Industries® has released a new educational video, DVD-18C, Soldering Terminals. The 37-minute video covers industry best practices for soldering wires to commonly used terminals in accordance with the latest IPC-A-610E and J-STD-001E acceptance standards.
Industry News | 2016-07-20 16:28:12.0
IPC has launched a new learning management system, IPC EDGE. This online learning platform is designed to deliver the education needed to acquire and develop the competitive skills necessary to excel in the electronics industry. Through white papers, webinars, IPC standards, skill development and foundation courses, users gain the flexibility to learn the skills needed to advance their careers and improve the industry.
Industry News | 2021-01-06 17:12:45.0
Effective January 1, 2021, IPC has promoted Sanjay Huprikar to president of Europe and South Asia Operations
Industry News | 2021-03-12 04:40:18.0
In recognition and acknowledgement of her extraordinary contributions to IPC and the electronics industry, Karen McConnell, Northrop Grumman, was presented with the IPC Raymond E. Pritchard Hall of Fame Award at IPC APEX EXPO on Tuesday, March 9. IPC's most prestigious award, the Hall of Fame is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry.
PCB Libraries' "Footprint Expert" suite uses CAD LEAP(tm) Technology to greatly simplify footprint and 3D STEP model creation; it is used by tens of thousands of PCB designers and engineers all over the world.
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