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Organic Optical Waveguide Fabrication in a Manufacturing Environment

Technical Library | 2010-10-28 01:27:38.0

Optical waveguides based on organic materials have been fabricated in a laboratory environment but the scaling and manufacturing processes needed to produce these waveguides have been scant. The volume production of low loss organic waveguides in a conven

i3 Electronics

Fujikura FSM-30R

Fujikura FSM-30R

Used SMT Equipment | In-Circuit Testers

Fujikura FSM-30R Description: The Fujikura FSM-30R fusion splicer is an automatic core alignment splicer utilizing the direct core monitoring Profile Alignment System (PAS) to achieve ultra low loss and very accurate splice loss estimation, reg

Test Equipment Connection

Fujikura FSM-30R

Fujikura FSM-30R

Used SMT Equipment | In-Circuit Testers

Fujikura FSM-30R Description: The Fujikura FSM-30R fusion splicer is an automatic core alignment splicer utilizing the direct core monitoring Profile Alignment System (PAS) to achieve ultra low loss and very accurate splice loss estimation, reg

Test Equipment Connection

HTCC QFN Packages

HTCC QFN Packages

New Equipment | Components

HTCC QFN Packages to 40GHz High Temperature Co-Fired Ceramic (HTCC) QFN packages from Barry Industries feature low-loss broadband transitions for superior performance over frequency. HTCC construction provides for enhanced mechanical strength and h

Barry Industries, Inc.

2017 RaMP Workshop and Tabletop Exhibition

Events Calendar | Wed Apr 26 00:00:00 EDT 2017 - Thu Apr 27 00:00:00 EDT 2017 | Paris, France

2017 RaMP Workshop and Tabletop Exhibition

International Microelectronics Assembly and Packaging Society (IMAPS)

MPPE/SEBS Composites with Low Dielectric Loss for High-Frequency Copper Clad Laminates Applications

Technical Library | 2021-03-04 15:22:33.0

Copper clad laminates (CCLs) with low dissipation factor (Df) are urgently needed in the fields of high-frequency communications devices. A novel resin matrix of modified poly (2,6-dimethyl-1,4- phenylene ether) (MPPE) and styrene-ethylene/butylene-styrene (SEBS) was employed in the fabrication of high-frequency copper clad laminates (CCLs). The composites were reinforced by E-glass fabrics, which were modified with phenyltriethoxysilane (PhTES). The composite laminates obtained exhibited impressive dielectric loss of 0.0027 at 10 GHz when the weight ratio of MPPE to SEBS was 5:1.

Zhejiang University

Agilent 16195B

Agilent 16195B

Used SMT Equipment | In-Circuit Testers

Agilent-Keysight 16195B 7mm Calibration Kit for use with HP/Agilent 4287A RF LCR Meter Includes: E4991-60021 Short E4491-60022 Open 04287-60021 6 Ghz 7 mm termination 04287-60022 Low Loss Capacitor - See more at: http://www.testequipmentco

Test Equipment Connection

RO4000® Series High Frequency Circuit Materials

RO4000® Series High Frequency Circuit Materials

New Equipment | Materials

280°C). Unlike PTFE based microwave materials, no special through-hole treatments or handling procedures are required. RO4003C was designed with a dielectric constant of 3.38. The RO4350B has a dielectric constant of 3.48 and is UL94V-0 rated. RO445

Rogers Corporation

Isola - High Performance PCB Laminates

Isola - High Performance PCB Laminates

New Equipment | Materials

FR408 High Speed, Low Loss Modified Epoxy FR408 is a high-performance FR-4 modified epoxy laminate & prepreg system designed for advanced circuit applications. Its low dielectric constant and low dissipation factor make it an ideal candidate for br

INSULECTRO

Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate

Technical Library | 2007-10-25 18:39:07.0

More and more substrate designs require signals paths that can handle multi-gigahertz frequencies [1-3]. The challenges for organic substrates, in meeting these electrical requirements, include using high-speed, low-loss materials, manufacturing precise structures and making a reliable finished product. A new substrate technology is presented that addresses these challenges.

i3 Electronics


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