Electronics Forum | Mon Jul 23 11:44:40 EDT 2007 | davef
NASA-STD-8739.1, 10.2.3 Thickness Measurements. Thickness measurements shall be made on coupons processed at the same time and under the same conditions as the PWA. The coupon substrate may be any compatible rigid material with a smooth flat surface.
Electronics Forum | Wed Jul 02 02:46:44 EDT 2008 | tang
Hi Guys, I have few question would like to ask regarding pcb conformal coating: 1. Can I know which masking material is the best for easy apply, fast cure, fast & easy to remove after coating & baking. And no chemical reaction which will whiten the
Electronics Forum | Wed Jul 26 11:56:40 EDT 2017 | rgduval
Ah...the joys of subjective analysis! At a glance, these pictures look fine to me. Other than the IC's, which you've indicated were masked, and, maybe R12 in the last picture and CC1384 in the first image, coating looks uniform and well distributed
Electronics Forum | Tue Jul 25 16:08:52 EDT 2017 | dontfeedphils
I'm currently working on bringing a manual coating process/workcenter online and my QA team is giving me some grief. For background, we're using Humiseal 1B31 thinned with thinner 521, mixed at 1:1 by volume. Spraying through a Binks HVLP with 10 P
Electronics Forum | Tue Nov 27 20:05:31 EST 2007 | shy
Dback, Current method is by using dispenser machine to dispense the glue at PCB. This non-wetting is randomly and not repeating to the same location. My adhesive height is 0.01" to 0.035". Is this will cause the component to had a gap between the t
Electronics Forum | Fri Dec 16 08:00:26 EST 2005 | jax
What you are most likely dealing with: Insufficient Pure Sn layer ( multiple causes ) Because elevated temperatures accelerate the diffusion process, the thickness of the Pure Sn layer will reduce during every thermal cycle... ( bakeing PCBs, S
Electronics Forum | Thu Sep 09 21:50:53 EDT 1999 | kyung sam park
2 will have enormous impact on every other process. | | thank in advance. scott. I appreciate your sincere answer. would tell me the hint about printer if i's possible To tune our smt process we have to know what is the major X's for defect.
Electronics Forum | Thu Sep 09 22:18:13 EDT 1999 | Dave F
2 will have enormous impact on every other process. | | | thank in advance. | | | scott. | I appreciate your sincere answer. | would tell me the hint about printer if i's possible | To tune our smt process we have to know what is the major X
Electronics Forum | Tue Dec 22 12:32:16 EST 1998 | Earl Moon
| Folk's, | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colour, texture,
Electronics Forum | Sun Aug 08 11:15:32 EDT 1999 | Earl Moon
| | Mike, | | | | Got your message and those of others concerning PCB fab supplier evaluation and qualification check lists, etc. I have a severe problem here in WI as I can hardly access the internet, and when I do it is cut off abruptly for no goo
