Industry Directory | Marketing Agency
B2B Strategic Marketing Communications, Specialties: Public Relations, Strategic Marketing Communications, Event Marketing, Media Planning & Placement, Social Media Marketing.
The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs High Speed, High Accuracy, Precision Dispensing System. Higher consistency leads to higher yield and maximum profitability
The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,
Electronics Forum | Fri Feb 04 15:14:19 EST 2000 | JDobos
Would like to make discuss the nature of MEM's style packaging with someone with experience in this area.
Electronics Forum | Wed Aug 15 18:33:43 EDT 2001 | JoAnn
The SMTA will be holding a MEMS session at SMTA International in the fall. Please visit http://www.smta.org/smtai and click Special Events. The Emerging Technologies Summit will offer some very good papers on MEMS.
Used SMT Equipment | In-Circuit Testers
Yokogawa DL708E Bandwidth: 410 Mhz Channels: 8 Yokogawa 701820 DL708E Digital Oscilloscope, 8 Ch, 100k/Ch Mem The Yokogawa 701820 oscilloscope is a graph-displaying device - it draws a graph of an electrical signal. In most applications, the
Used SMT Equipment | In-Circuit Testers
Yokogawa DL708E Bandwidth: 410 Mhz Channels: 8 Yokogawa 701820 DL708E Digital Oscilloscope, 8 Ch, 100k/Ch Mem The Yokogawa 701820 oscilloscope is a graph-displaying device - it draws a graph of an electrical signal. In most applications, the
Industry News | 2011-09-21 12:11:34.0
GPD Global will showcase its Positive Cavity Displacement (PCD) 'H' Series high resolution pumps in Booth #133 at the upcoming SMTA International Conference & Exhibition.
Industry News | 2011-06-13 17:25:04.0
GPD Global will demonstrate its award-winning Positive Cavity Displacement (PCD) Dispensing in Booth #6186 in the North Hall at the upcoming SEMICON West, scheduled to take place July 12-14, 2011 at the Moscone Center in San Francisco.
Parts & Supplies | Pick and Place/Feeders
Mass memory board KSP-MEM364
Technical Library | 2023-10-09 15:18:50.0
This technical document provides necessary information and general guidelines for soldering and PCB design for the Würth Elektronik eiSos MEMS sensor products with an LGA surface-mount package
Technical Library | 2010-06-24 21:20:05.0
Cost-effective assembly of custom-designed microelectromechanical systems (MEMS) for medium-caliber fuzes is challenging. In particular, the environment must have a setback acceleration exceeding 60,000g and centripetal acceleration of 9000g/mm out of center in a 30mm#2;173 projectile. In addition, the space available is very limited. The traditional approach is to mount the MEMS chip in a package that is then soldered to the printed circuit board (PCB). However, by mounting the MEMS chip directly to the PCB using conductive adhesive, we can increase the packaging density while reducing manufacturing cost.
Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.
03001846S03 CAMERA VISUAL SHIELD TWIN HEAD 03001848-01 Cover, Headboard Sx/Fx 03001855S01 Nozzle Changer, 12-Nozzle Head, HF 03001939S02 DC/DC-CONVERTER 5V/24V 03001949-01 Klettostar-Haft 20x80 03001959S01 Z-Axis complete DLM2 03002008S01 Blast
Events Calendar | Tue Jul 10 00:00:00 EDT 2018 - Thu Jul 12 00:00:00 EDT 2018 | San Francisco, California USA
Semicon West
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Philadelphia, New Jersey USA | Sales/Marketing
LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e
Wafer-Level Packaged MEMS Switch With TSV Wafer-Level Packaged MEMS Switch With TSV by: Nicolas Lietaer, Thor Bakke, Anand Summanwar; SINTEF , Per Dalsjø, Jakob Gakkestad; Norwegian Defence Research Establishment (FFI), Frank Niklaus; KTH - Royal
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