Industry News | 2019-01-30 08:42:31.0
SHENMAO America, Inc. is pleased to announce that it was awarded a 2019 NPI Award in the category of Flux for its SM-862 Liquid Flux. The award was presented to the company during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
Industry News | 2022-03-14 08:20:37.0
SHENMAO America, Inc. is pleased to introduce its PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy, which is designed with high thermal impact reliability for long service life electronic products with high-reliability requirements.
Industry News | 2023-02-27 18:10:50.0
SHENMAO America, Inc. has released its PF735-PQ10-10L Low Melting Point Lead-Free Solder Paste. The paste has been designed specifically for the SMT process and is applicable to the high-speed printing process to increase production capacity.
Industry News | 2017-11-14 18:42:02.0
Hanwha Techwin today announced that it was awarded a 2017 Global Technology Award in the category of LED Production Equipment for its SM481PLUS. The award was presented to the company during a Tuesday, Nov. 14, 2017 ceremony that took place during productronica in Munich, Germany.
Industry News | 2011-12-07 21:12:14.0
ACD announces the purchase of a VisionMaster 150 solder paste inspection (SPI) system. The VM150 will enable ACD to obtain 3-D color profiles for fast, accurate paste analysis.
Industry News | 2019-11-13 11:33:38.0
SHENMAO America, Inc. announces that it was awarded a 2019 Global Technology Award in the category of Solder Paste for its PF735-PQ10 Low Temperature Solder (LTS). The award was presented to the company during a Tuesday, Nov. 12, 2019 ceremony that took place during productronica in Munich, Germany.
Industry News | 2008-04-17 15:39:50.0
Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces a software upgrade for its existing CLM/FLX-Series placement systems that results in more power.
Industry News | 2016-03-10 19:12:32.0
Photo Stencil will showcase advanced stencils for printing the most demanding PCB and semiconductor packaging designs at IPC APEX 2016, Las Vegas, CO, March 15-17, 2016, in booth #825.
Industry News | 2018-10-18 11:23:54.0
6 Things to Check Before Submitting Your PCB Design for Manufacturing
Industry News | 2010-08-27 15:08:50.0
Highly concentrated heat sources found in ever shrinking electronic designs have increased the demand for better heat dissipation. SMT has introduced several machines that accommodate larger, odd shaped substrates. The machines offer the same speed, precision, and repeatability found on SMT’s solder paste printers. This allows heat sink manufacturers to benefit from using proven, cost effective screen print technology
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