Electronics Forum | Wed Oct 20 07:59:34 EDT 2010 | gallionc
After 16 years in the industry, I have honestly never heard of putting wax in a solder pot. Anyway, I do have some experience with Treiber wave solder machines, and as I recall, the air-driven pumps are a nightmare to service. First of all, make su
Electronics Forum | Wed Nov 07 11:56:44 EST 2001 | mparker
Pad spacing is just one element to consider. Your pad spacing is determined by the pitch (center to center distance between the leads). There are several good resources to find the appropriate pitch per device. Search the archives here or refer to th
Electronics Forum | Mon Jul 08 14:52:40 EDT 2013 | hegemon
The smaller ball "missing" from the lower left is from solder migrating down into the adjacent via. The solder mask may have been damaged or missing prior to mounting the BGA device. The larger balls at the top right are due to uneven heating during
Electronics Forum | Tue Mar 27 06:27:41 EDT 2018 | cyber_wolf
Occasionally when circuit boards are manufactured, there may be issues with solder mask coverage. It is not uncommon to re-run back through this process to fix missing or thin areas. This can causes the traces to become higher which in turn raises th
Electronics Forum | Thu Mar 25 20:50:50 EDT 2021 | stephendo
A couple more things. The PCB. What size are the pads? One time a board shop had difficulty putting masking between the pads of a QFP and the pads suffered as a result. When I told them they didn't have to have masking between the pads, the pads w
Electronics Forum | Mon Nov 01 16:41:58 EST 1999 | Robert Culpepper
Hello Mark, I can�t provide any hands on feedback with 0402 packages but we are using a no clean process with 0603 devices. Here are some parameters which will affect solder balling. Stencil thickness, aperture size, paste viscosity, snap off and bot
Electronics Forum | Wed Feb 01 08:12:04 EST 2006 | Chunks
OK, this is easy. You say HIGH fall out, so I can assume 25 or 50%? If so, run 10 without the heat gun and 10 with. This should show you if the heat gun process is the cause or not. If the relay is a surface mount, hand solder them on. If it's a
Electronics Forum | Mon Feb 08 17:11:04 EST 1999 | chris arnold
| I realize it's been discussed many times before. I need to know your opinions, experience, and knowledge concerning "today's"/latest and best pallet designs, suppliers, and methods for using them more effectively. Earl, Pallets can be extremely u
Electronics Forum | Wed Nov 28 01:28:32 EST 2007 | shy
Q1:What is the relation between component standoff and drop missing? A1:component standoff will identify either solder paste at SMT side can form the fillet at component terminal or not. Drop/missing component is totally out of the topics since i jus
Electronics Forum | Wed Feb 14 21:14:45 EST 2001 | davef
BGA Shorting 1 Damaged mask in between the BGA pad and via on the substrate. 2 Poor print registration. 3 Poor via segregation from the pads? Are they tented or is there just a dam in between? 4 Review the profile. You can run into a number of p
