Industry News | 2012-04-05 13:44:28.0
IPC's second annual Conference on Electronics Assembly: Soldering, Assembly & Inspection, held in Budapest, Hungary last month saw an increase of 21 percent in attendees and a 44 percent increase in exhibitors over its inaugural event last year.
Industry News | 2008-04-21 14:58:41.0
Minneapolis**, MN�* An Evolving Technologies Summit is scheduled during the SMTA�s annual conference, SMTA International, at the Disney's Coronado Springs Resort and Convention Center, Orlando, FL, from August 17-21, 2008.
Industry News | 2024-04-29 08:34:13.0
At IPC APEX EXPO 2024 in Anaheim, Calif., five competitors squared off to determine who was the best of the best at PCB design.
Industry News | 2024-04-15 11:05:25.0
IPC presented its highest corporate honors to two IPC member companies, Summit Interconnect and Robert Bosch GmbH during the IPC Annual Meeting/Awards Ceremony at IPC APEX EXPO 2024. The Peter Sarmanian Corporate Recognition Award was presented to Summit Interconnect and the Stan Plzak Corporate Recognition Award was presented to Robert Bosch GmbH.
Industry News | 2013-05-06 18:48:35.0
IPC – Association Connecting Electronics Industries® announces an ambitious technical agenda for the IPC/FED Conference on Embedded Components.
Industry News | 2003-03-31 09:51:04.0
The SMTA has formed the SMTA International Technical Committee for 2003.
Industry News | 2014-11-03 19:28:27.0
SMTA announced that the program is finalized for the 20th Annual Pan Pacific Microelectronics Symposium.
Industry News | 2018-03-01 19:16:41.0
IPC APEX EXPO 2018 IPC Booth 2533.
Industry News | 2015-07-08 14:20:26.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), a global leader in dispensing, jetting, and coating equipment and technologies, announces its new Programmable Tilt + Rotate 5-Axis Fluid Dispenser that enables the jet to dispense using 5 axes of automated control instead of only 3 axes. The additional X and Y tilt modes enable dispensing from a vertical position and at varying tilt angles along all four sides of a device and up the side of a substrate or component, especially for 3D packages, while meeting stringent requirements for precision, accuracy, and speed. It enables dispensing of underfill, encapsulant, and coating fluids around tall substrate components on PCBs, flexible circuits, and in densely populated boards; provides precision fluid delivery to multiple sides of the latest-generation mobile device cases and sub-component camera modules by moving the nozzle tip closer to a target location such as a vertical wall; and dispenses into tight corners and narrow gaps in advanced packages.
Industry News | 2013-06-26 14:34:43.0
Nordson ASYMTEK will be hosting live demonstrations of precision coating and jetting processes at SEMICON West 2013. Engineers will be available to discuss equipment, applications, and the manufacturing process.
