Full Site - : multicore (Page 3 of 25)

LOCTITE HF 212 Halogen-Free Solder Paste

LOCTITE HF 212 Halogen-Free Solder Paste

New Equipment | Solder Materials

8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr

Henkel Electronic Materials

Henkel Launches High-Lead and Lead-Free Capable Die Attach Solder Paste for Enhanced Thermal Control of Power Devices

Industry News | 2009-07-24 13:38:04.0

To address the thermal requirements posed by smaller outline, higher functioning power semiconductor devices, Henkel has formulated an advanced die attach solder paste suitable for both high-lead and lead-free applications.

Henkel Electronic Materials

TRI Highlights Smart Factory Inspection Solutions at IPC APEX EXPO 2019

Industry News | 2019-01-06 21:27:59.0

[December 14, 2018 – San Jose, CA] Test Research, Inc. (TRI), the leading test and inspection solutions provider for the electronics manufacturing industry will join IPC APEX EXPO 2019 held at San Diego Convention Center to showcase its Smart Factory inspection and test solutions for the printed circuit board electronics manufacturing industry. Visit TRI at booth #2533 on January 29 – January 31, 2019 to discover the newest innovations in 3D SPI, 3D AOI, 3D CT AXI and multicore ICT.

TRI - Test Research, Inc. USA

CAMI Research, a WHCC Top Product Winner, Reports Milestone Continuity Measurement

Industry News | 2016-07-21 23:27:53.0

CAMI Research reports that a customer has successfully tested simultaneous, multipoint continuity in a two-mile long, multicore cable (rated at 10Ω/1000ft) using a CableEye M3UH tester.

CAMI Research Inc.

Henkel to Show Latest Materials Innovations at APEX 2010

Industry News | 2010-03-17 18:53:38.0

Customers visiting Henkel at the upcoming APEX 2010 event in Las Vegas will quickly discover that partnering with the materials leader is no gamble. A continued emphasis on product innovation and R&D investment – even throughout the recent downturn – has placed the company firmly at the top among electronics materials suppliers, with materials solutions and global resources that are unmatched.

Henkel Electronic Materials

Innovation Wins Big at APEX: Henkel R&D Commitment Results in Impressive Awards Haul

Industry News | 2009-04-09 22:35:29.0

The current economic climate, though challenging, certainly hasn't deterred the technology specialists at Henkel from continuing on an aggressive R&D path. As evidenced by an impressive five award wins during last week's APEX show in Las Vegas, Nevada, Henkel's commitment to innovation and materials advance is stronger than ever.

Henkel Electronic Materials

New System-on-Module M100PFS Based on Microchip’s Low-power PolarFire SoC FPGA

Industry News | 2020-01-30 09:45:27.0

Embedded World 2020: ARIES Embedded Integrates Industry’s First Multi-Core RISC-V System-on-Chip FPGA

ARIES Embedded GmbH

HONEYWELL FTA-T-02 24 CHANNEL MODULE

HONEYWELL FTA-T-02 24 CHANNEL MODULE

New Equipment | Industrial Automation

  Sandy.[mailto:unity@mvme.cn]    Sandy.[WhatsApp/Skype/Mobile:+8618020776786]     Sandy.[Quote to you within the shortest possible time with our best price]   Warranty: up to 12 months Shipping: fast delivery is available NEW+ORIGINAL+IN STOCK+ONE

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

HONEYWELL FTA-T-02 24 CHANNEL MODULE

HONEYWELL FTA-T-02 24 CHANNEL MODULE

New Equipment | Industrial Automation

  Sandy.[mailto:unity@mvme.cn]    Sandy.[WhatsApp/Skype/Mobile:+8618020776786]     Sandy.[Quote to you within the shortest possible time with our best price]   Warranty: up to 12 months Shipping: fast delivery is available NEW+ORIGINAL+IN STOCK+ONE

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

TRI to join the SMTA Guadalajara Expo 2022

Industry News | 2022-08-14 14:29:19.0

Test Research, Inc. (TRI) will join the SMTA Guadalajara Expo 2022 to showcase our award-winning Inspection solutions for the SMT industry. Visit booth #103 at the SMTA Expo Guadalajara from September 21 to September 22, 2022, to learn more about the latest innovations in 3D SPI, 3D AOI, 3D AXI, and multicore ICT.

TRI - Test Research, Inc. USA


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