Technical Library | 2012-10-18 21:58:51.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package called TOPS – on PCBs with a Ni/Au surface finish.
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Fuji lfPA4110 COLLAR Fuji MPA4090 COLLAR Fuji KPA4021 HOLDER Fuji MPA4100 KEYFuji MPA5330 COLLAR Fuji S1022A CIR-CLIP Fuji MPA5262 HOLDER ROLLER Fuji MPA5224 LEVER Fuji MPA5231 BKT Fuji MPA5340 SPRING Fuji H5324A BOLT HEX SOCKET Fuji MPA202
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• Material grades: N35 to N52, N44SH, N40UH, N38EH and N30AH • Br: up to 14.2kg (maximum) • Hcj: up to 35KOe (maximum) • BH: up to 54MGOe (maximum) • Surface treatment: zinc, nickel, Ni + Cu + Ni, epoxy, parylene, zinc/parylene and Ni + Cu + Ni +
This product we supply GE(General Electric company) for 50, 000 pcs per year. We can provide the best quality but the lowest price. Alloy Dimensions (mm) Thickness Width Length W-Ni-Fe 0.1-0.5 50-200 ��100 W-Ni-Cu
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Global soldering materials manufacturer founded in 1980 headquartered in IL. U.S.A. Products include: RoHS lead free solders + leaded, Metals Recycling Program, Solder Check Up Program, Technical Support. ISO 9001:2015 Certified
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Pandawill Circuits manufacture and supply a wide range of high quality PCB technologies, volumes, cost and manufacturing lead-time options based on our fundamental understanding of the PCB manufacture
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