Electronics Forum | Mon Sep 14 17:39:37 EDT 1998 | Steve A
| I am running composite fixtures on my wave solder machine and after about 500 passes each (1 month)they are showing serious signs of wear in that the composite surface is bubbling up and glass fibers are also starting to show. | The problem here
Electronics Forum | Tue Sep 15 07:54:42 EDT 1998 | Rob Fischer
| | I am running composite fixtures on my wave solder machine and after about 500 passes each (1 month)they are showing serious signs of wear in that the composite surface is bubbling up and glass fibers are also starting to show. | | The problem h
Electronics Forum | Mon May 24 13:33:46 EDT 1999 | Dave F
| We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendor
Electronics Forum | Thu Apr 11 20:35:22 EDT 2002 | davef
Messy. Messy. Messy. Consider gluing these components, until you control your process. It is unclear to us that a single factor drives these defects, but multiple factors that need to be tuned to work well together. PAD DIMENSIONS * Some SM-782 pa
Electronics Forum | Thu Aug 13 14:10:01 EDT 2015 | markhoch
Hi Sam, I have a feeling that what you're trying to communicate is that your DPAK's are skewing off the pad during reflow. This is caused by a thermal "mismatch" where the solder paste on one side of the DPAK becomes molten before the other, then th
Electronics Forum | Mon Nov 06 10:29:28 EST 2000 | Dean Stadem
All of the replies have merit. Here is another one. Because the cause of the tombstoning is wetting forces that are imbalanced, and one end wets faster or more readily than the other, the 0402 lifts up on that end easily because of its low mass. Incr
Electronics Forum | Thu Mar 16 14:04:14 EST 2000 | Cartman
Greetings. My company has a VOC-Free no-clean wave solder flux with 4% solids. I have a number of questions as they relate to our ICT Fixtures. Currently, we're encountering the following issues: 1.) PM on probes....What is the recommended PM p
Electronics Forum | Thu Jun 13 11:27:25 EDT 2002 | davef
>*Changing paste >EricD: Yes we are considering that as a point. Because I believe the paste we are using are in syringe packaged and designed for dispensing. We are using an Indium SMQ75 paste and current application naturally is stencil printing.
Electronics Forum | Wed Mar 05 11:45:04 EST 2003 | msivigny
Hello Yngwie, When we look at the technical benefits of using N2, you'll find that your customer is trying to get a better product. Now as we discuss just a few of the reasons to use N2, when O2 is present in the heating atmosphere it carries oxides
Electronics Forum | Tue Aug 18 10:11:04 EDT 2009 | grantp
Hi, Yes, I think this sounds like a form of tomb-stoning, and we used vapor phase until it ended up driving us totally nuts trying to deal with tomb-stoning. We tried everything, and all kinds of stencil apertures. Vapor phase is an amazing process
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