New Equipment | Solder Materials
Flux designed specifically to work with KappZapp7, 7.0% Silver solder to remove the oxide layer on Copper to allow a strong metallic bond between the solder and the base metal. Its active range is 500°F - 750°F (260°C - 390°C). Kapp Copper-Bond Flux
Technical Library | 2021-04-16 05:38:38.0
The overall process of manufacturing electronics assemblies is characterized by a number of very different procedures. Along the production chain, technologies for cutting, assembling, soldering, bonding, gluing, marking, potting, etc. are used, all of them have one thing in common: They produce airborne pollutants, some of which can have a significant impact on employees, manufacturing equipment and products - and for this reason need to be removed effectively and efficiently.
Technical Library | 2015-09-23 22:08:32.0
A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. (...) Flip chip bonding of bare die on MID can be employed to fully utilize MID’s advantage in device miniaturization. Compared to the traditional soldering process, thermo-compression bonding with gold stud bumps provides a clear advantage in its fine pitch capability. However, challenges also exist. Few studies have been made on thermocompression bonding on MID substrate, accordingly little information is available on process optimization, material compatibility and bonding reliability. Unlike solder reflow, there is no solder involved and no “self-alignment,” therefore the thermo-compression bonding process is significantly more dependent on the capability of the machine for chip assembly alignment.
Complex functions are compressed on ever less room while simultaneously an enhancement in performance must be obtained. With coated Bonding pads in various designs Heraeus Materials Technology offers customer oriented solutions that aid the increas
Industry Directory | Manufacturer
Skylink specialize in wireless technology for consumer products, and offers contract manufacturing of PCB assembly, OEM / ODM projects
Industry Directory | Manufacturer
Military Certified PCB Fabrication & Circuit Board Assembly Manufacturer Custom PCB fabrication in as little as 8 hours – All you have to do is ask! 16 Years Of PCB Manufacturing - Serving Electronic Since 2001
This is a brief functional demonstration of the Xylon Cheetah X-ray. The video shows the machine x-ray components on a pcb. In the video, you can see wire bonds and solder voids. This 2011 Cheetah is available at the Capital Equipment Exchange.
Technical Library | 2012-10-11 19:50:09.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. This paper shows the benefits by using a pure palladium Layer in the ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold) and ENEP (Electroless Nickel, Electroless P
Industry News | 2020-10-12 13:22:22.0
We are pleased to announce and introduce C-Tech Systems, B.V. as the company that will be assuming the Hot Bar Soldering and Bonding product lines, including continuing support of all customers currently using the products. For sales and service support of Hot Bar Soldering and Bonding product lines, visit the C-Tech Systems website. Visit the Nordson ELECTRONICS SOLUTIONS site for information on precision fluid dispensing, plasma treatment, selective soldering and test and inspection capabilities.
Industry Directory | Consultant / Service Provider
Serving the Educational Needs of Modern Technologies
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