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KYZEN to Focus on Chemistry and Process Control at SMTA Oregon

Industry News | 2023-05-15 18:12:54.0

KYZEN will exhibit at the SMTA Oregon Expo & Tech Forum, scheduled to take place Thursday, June 8, 2023 in Wilsonville, Oregon. The KYZEN team will spotlight the KYZEN Process Control System (PCS), the world's first and only concentration monitoring and control system, in addition to the award-winning aqueous solutions AQUANOX A4625 and AQUANOX A4626.

KYZEN Corporation

SHENMAO to exhibit new pastes at SMTAI SHENMAO pastes reduce peak reflow temperature, energy consumption, and warpage of PCBs and components

Industry News | 2018-09-18 20:19:23.0

SHENMAO America, Inc. is pleased to announce plans to exhibit in booth 233 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon. During the two-day expo, the company will showcase its PQ10 low-temperature solder paste and PF606-P245 new generation lead-free zero halogen solder paste.

Shenmao Technology Inc.

Christopher Associates Premiers Solder Pastes from Koki for ICT Performance and Fine-Pitch Printing

Industry News | 2009-12-14 20:45:09.0

December 2009 ? Christopher Associates, a pioneering supplier and distributor to the electronics and chemical processing industries, introduces two new solder pastes from Koki Company Ltd. (Tokyo, Japan).

Christopher Associates Inc.

MacDermid Alpha to Promote Latest Interconnect Technologies and Present on Microvia Reliability at the 2021 Virtual IPC APEX Exhibition and Conference

Industry News | 2021-02-25 13:41:10.0

MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.

MacDermid Alpha Electronics Solutions

Characterize and Understand Functional Performance Of Cleaning QFN Packages on PCB Assemblies

Technical Library | 2022-12-19 18:59:51.0

Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.

iNEMI (International Electronics Manufacturing Initiative)

SHENMAO SM-901 Water-Based Wave Soldering Flux Ideal for Lead-Free and Tin-Lead Wave Soldering

Industry News | 2019-05-27 21:25:14.0

SHENMAO America, Inc.’s SM-901 Water-Based Wave Soldering Flux has been designed for use in lead-free and tin-lead wave soldering applications. The company also offers the SMCW Series Water-Based Cleaner, which is ideal for removing flux residues and other smudges.

Shenmao Technology Inc.

Kester to Exhibit and Present at SMTA China East 2016 Technology Conference & NEPCON China

Industry News | 2016-04-18 11:31:46.0

Kester will be exhibiting together with Speedline and Vitronic Soltec (booth # 1G40, Hall 1) at SMTA China East Conference 2016 which will be held in conjunction with NEPCON China 2016 in Shanghai on April 26-28.

Kester

FCT Assembly to Showcase Proven Solder Paste and Stencil Technologies at SMTA International 2011

Industry News | 2011-09-21 13:59:11.0

FCT Assembly announces that it will showcase its new line of no-clean, halogen-free solder pastes along with its latest stencil technologies in Booth #206 at the upcoming SMTA International Conference & Exhibition.

FCT ASSEMBLY, INC.

See FCT Assembly’s Best-in-Class Solder and Stencil Technologies at the 2012 IPC APEX Expo

Industry News | 2012-01-24 16:23:30.0

FCT Assembly will showcase its new line of no-clean, halogen-free solder pastes along with its latest stencil technologies in Booth #612 at the upcoming IPC APEX Expo.

FCT ASSEMBLY, INC.

KYZEN Puts Focus on Understencil and PCB Cleaners at SMTA Querétaro

Industry News | 2024-05-27 13:19:06.0

KYZEN will exhibit at the SMTA Querétaro Expo & Tech Forum, scheduled to take place Thursday, June 6, at Querétaro Centro de Congresos y Teatro Metropolitano. The KYZEN clean team will showcase understencil cleaning chemistry KYZEN E5631J and aqueous cleaning solution AQUANOX A4618.

KYZEN Corporation


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