New Equipment | Solder Materials
An alcohol based, halide free, no-clean liquid flux designed specifically to have a very wide process window for wave solder applications.Flux, No Clean Liquid, NC-264-5, (4 Gallon Case)
Technical Library | 2018-08-29 21:17:53.0
No-clean solder pastes are widely used in a number of applications that are exposed to wide variations in temperature during the life of the assembled electronics device. Some have observed that cracks can and do form in flux residue and have postulated that this is the result of or exacerbated by temperature cycling. Furthermore, the potential exists for the flux residue to soften or liquefy at elevated temperatures, and even flow if orientated parallel to gravity. In situations such as in automotive electronics, where significant temperature cycling is a reality and high reliability is a must, concern sometimes exists that the cracking and possible softening or liquefying of the residue may have a deleterious effect on the electrical reliability of the flux residue. This paper will attempt to address this concern.
Industry Directory | Manufacturer
OMG is the manufacturer of the Microbond line of solder pastes, fluxes and solder spheres.
Industry Directory | Manufacturer
We are offering EMS services,& We are one of the leading suppliers of soldering materials like Solder Sticks/Bars Pastes, IPA,& Soldering Fluxes,& Buyers of solder dross, cut leads and waste chemicals
Technical Library | 2023-04-17 17:05:47.0
In an ideal world, manufacturing devices would work all of the time, however, every company receives customer returns for a variety of reasons. If these returned parts contributed to a fail, most companies will perform failure analysis (FA) on the returned parts to determine the root cause of the failure. Failure can occur for a multitude of reasons, for example: wear out, fatigue, design issues, manufacturing flaw or defect. This information is then used to improve the overall quality of the product and prevent reoccurrence. If no defect is found, it is possible that in fact the product has no defect. On the other hand, the defect could be elusive and the FA techniques insufficient to detect said deficiency. No-clean flux residues can cause intermittent or elusive, hard to find defects. In an attempt to understand the effects of no-clean flux residues from the secondary soldering and cleaning processes, a matrix of varying process and cleaning operation was investigated. Of special interest, traveling flux residues and entrapped residues were examined, as well as localized and batch cleaning processes. Various techniques were employed to test the remaining residues in order to assess their propensity to cause a latent failure. These techniques include Surface Insulation Resistance1 (SIR) testing at 40⁰C/90% RH, 5 VDC bias along with C32 testing and Ion Exchange Chromatography (IC). These techniques facilitate the assessment of the capillary effect the tight spacing these component structures have when flux residues are present. It is expected that dendritic shorting and measurable current leakage will occur, indicating a failing SIR test. However, since the residue resides under the discrete components, there will be no visual evidence of dendritic growth or metal migration.
Industry News | 2024-08-12 15:07:45.0
SHENMAO America, Inc. is pleased to announce the launch of its latest innovation, the Rosin-Free No-Clean Liquid Flux SM-ZR10, specifically designed for automatic wave soldering processes. The no-clean liquid flux offers superior soldering performance, easy maintenance, and compliance with stringent environmental standards.
Technical Library | 2017-08-17 12:23:27.0
A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes, and imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achieved by a well-engineered miscibility between epoxy and no-clean solder paste flux systems, and is further assured with the introduction of a venting channel. The compatibility enables a single bonding step for BGAs or CSPs, which exhibit high thermal warpage, to form a high-reliability assembly. Requirements in drop test, thermal cycling test (TCT), and SIR are all met by this epoxy flux, EF-A. The high viscosity stability at ambient temperature is another critical element in building a robust and userfriendly epoxy flux system. EF-A can be deposited with dipping, dispensing, and jetting. Its 75°C Tg facilitates good reworkability and minimizes the adverse impact of unfilled underfill material on TCT of BGA assemblies.
Used SMT Equipment | Soldering - Selective
ACE KISS-103 Selective Soldering Unit (2011)Brand: ACEModel: KISS-103Year: 2011Lead-free process (titanium solderpot)Topside Preheat with pyrometer controlsDrop Jet precision flux applicator (for no-clean processing)220 VAC, 50/60 Hz, 8 amp, Single p
Used SMT Equipment | Soldering - Selective
ACE KISS-103 Selective Soldering Unit (2011)Brand: ACEModel: KISS-103Year: 2011Lead-free process (titanium solderpot)Topside Preheat with pyrometer controlsDrop Jet precision flux applicator (for no-clean processing)220 VAC, 50/60 Hz, 8 amp, Single p
Used SMT Equipment | Soldering - Selective
RPS Rhythm SS Selective Soldering System In-Line Conveyor, L to R Board Flow Leaded and Lead Free Pots Drop Jet Fluxer (no clean flux) Spray Fluxer (water wash) Nitrogen SMEMA 208V Fully Functional FOB: Origin Contact Assured Technical Ser
