Technical Library | 2013-12-27 10:39:21.0
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies, generating much concern. A head-in-pillow defect is the incomplete wetting of the entire solder joint of a Ball-Grid Array (BGA), Chip-Scale Package (CSP), or even a Package-On-Package (PoP) and is characterized as a process anomaly, where the solder paste and BGA ball both reflow but do not coalesce. When looking at a cross-section, it actually looks like a head has pressed into a soft pillow. There are two main sources of head-in-pillow defects: poor wetting and PWB or package warpage. Poor wetting can result from a variety of sources, such as solder ball oxidation, an inappropriate thermal reflow profile or poor fluxing action. This paper addresses the three sources or contributing issues (supply, process & material) of the head-in-pillow defects. It will thoroughly review these three issues and how they relate to result in head-in pillow defects. In addition, a head-in-pillow elimination plan will be presented with real life examples will be to illustrate these head-in-pillow solutions.
New Equipment | Selective Soldering
http://www.flason-smt.com/product/Selective-Wave-Soldering-Machine.html Selective Wave Soldering Machine Selective Wave Soldering Machine Selective Wave Soldering Selective Soldering Machine Selective Soldering Product description: Selective
Industry News | 2011-04-06 13:13:52.0
Dow Electronic Materials will showcase its innovative materials for printed circuit boards (PCBs) at this year’s IPC APEX EXPO. Dow will feature a number of its latest products that are tailored to meet the requirements of increasingly complex circuit boards while delivering ever-higher reliability and consistency. Dow’s next-generation of high quality, cost-effective technologies allow customers to meet future market requirements.
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
New Equipment | Wave Soldering
Selective Wave Soldering Machine max solder temperature 350℃ solder pot capacity 15 KG dimension L1280mm X W1400mm X H1650mm Net weight 380KG Product description: max solder temperature 350℃ ,solder pot capacity 15 KG,dimension L12
Panasonic CM602 BEARING DDR-830ZZ N510017124AA Panasonic CM602 BEARING DDR-830ZZ N510017124AA SMT Spare Parts Panasonic Spare Parts Delivery time: 1-3 days Product description: Panasonic CM602 BEARING DDR-830ZZ N510017124AA INQUIRY Pan
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Industry News | 2014-09-04 23:32:50.0
Indium Corporation's Wolfgang Bloching, regional sales manager for Germany, Austria, and Switzerland, will present at Yamaha Technology Day on Oct. 1 in Neuss, Germany.
Industry News | 2023-11-06 12:42:11.0
Altus Group has announced a significant enhancement to its product offerings with the introduction of Solderstar's cutting-edge technology, the Reflow Shuttle O2 measurement module.
Industry News | 2023-10-16 11:56:01.0
Booth A4.246/4
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411