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Parts & Supplies | Pick and Place/Feeders
Hot sell JUKI GAS SPRING B RH06 6Z51 40118515 Original new Supply all juki spare parts at low price JUKI ESR14048000 FLUX COLLECTION MAT 450N FUJINTAI TECHNOLOGY CO.,LTD JUKI ESR14048100 BUZZER STOP SWITCH PBS14 www.fujintai.com JUKI ESR14049
Parts & Supplies | Pick and Place/Feeders
Hot sell JUKI 750 760 HARD DISK E9614725000 Original new Supply all juki spare parts at low price JUKI ESR14062100 CONCENTRATION CONTOROLLER www.fujintai.com JUKI ESR14063100 OXYGEN SENSOR ASM. FUJINTAI TECHNOLOGY CO.,LTD JUKI ESR14064000 S=F
Used SMT Equipment | Soldering - Wave
this type can be added with nitrogen protection system 1 Flux spraying system 1.1 Spray fluxer can sense the board size automatically, and the spraying area can be adjusted according to the width of PCB. 1.2 Spray fluxer can sense the conveyor
Industry News | 2019-12-16 22:47:11.0
The difference between gas phase reflow welding and hot air reflow welding is that gas phase reflow welding USES vapor phase liquid to heat the key.
New Equipment | Selective Soldering
Pressure Swing Adsorption Principles： Pressure Swing Adsorption(PSA) is a form of advanced air separation technique that uses high quality Carbon Molecular Sieve(CMS) and pressure swing adsorption principles to produce high purity nitrogen gas T
New Equipment | Selective Soldering
Pressure Swing Adsorption Principles：Pressure Swing Adsorption(PSA) is a form of advanced air separation technique that uses high quality Carbon Molecular Sieve(CMS) and pressure swing adsorption principles to produce high purity nitrogen gas The PSA
The innovative inline soldering system for mass producers operate according to oxygen free process designed by ASSCON. Preheating and soldering is performed under oxygen free conditions. Components such as QFPs, BGAs, Flip-Chip and hybrids are proces
By definition, anaerobic adhesives remain liquid until isolated from oxygen in the presence of metal ions, such as iron or copper. For example, when an anaerobic adhesive is sealed between a nut and a bolt on a threaded assembly, it rapidly "cures" o
Technical Library | 2020-07-29 20:12:52.0
Aluminum is a metal that it is hard to solder due to the high surface tension difference between it and molten solder alloy. This occurs because aluminum rapidly forms a tenacious oxide layer whenever it is exposed to oxygen in the air. The oxide layer is responsible for the high surface tension difference between the aluminum and the solder and impedes the solder from spreading evenly on an aluminum surface. There are hundreds of aluminum alloys available in the marketplace; it is important to identify the form of aluminum that is being soldered. Once this is done, an appropriate soldering technique can be chosen for soldering the specific aluminum alloy under consideration. Direct aluminum soldering eliminates using expensive plating techniques to prepare the aluminum surface for soldering.
Technical Library | 2022-10-11 17:27:08.0
Lead-free flux technology for electronic industry is mainly driven by high soldering temperature, high alloy surface tension, miniaturization, air soldering due to low cost consideration, and environmental concern. Accordingly, the flux features desired included high thermal stability, high resistance against burn-off, high oxidation resistance, high oxygen barrier capability, low surface tension, high fluxing capacity, slow wetting, low moisture pickup, high hot viscosity, and halogen-free. For each of the features listed above, corresponding desired chemical structures can be deduced, and the impact of those structures on flux residue cleanability can be speculated. Overall, lead-free flux technology results in a greater difficulty in cleaning. Cleaner with a better matching solvency for the residue as well as a higher cleaning temperature or agitation are needed. Alkaline and polar cleaner are often needed to deal with the larger quantity of fluxing products. Reactive cleaner is also desired to address the side reaction products such as crosslinked residue.
