Electronics Forum | Mon Apr 09 16:48:27 EDT 2007 | ratsalad
How wide are your pads? What paste are you using? What is your board finish? Could you please post a link to the datasheet for the component? We place a lot of MLFs, both in a Pb and Pb-free process. Our standard stencil design for MLF compon
Electronics Forum | Mon Apr 19 22:52:59 EDT 1999 | Dean
25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo
Electronics Forum | Wed Sep 08 15:16:50 EDT 1999 | Jason Gregory
| | | Hello: | | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting into the ov
Electronics Forum | Wed Sep 08 17:34:26 EDT 1999 | Earl Moon
| | | | Hello: | | | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting into th
Electronics Forum | Wed Sep 08 20:26:30 EDT 1999 | Jackie Hsieh
| | | | | Hello: | | | | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting int
Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr
My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone
Electronics Forum | Thu Mar 25 23:23:00 EDT 2021 | llawrence
The QFP pitch is 0.5mm. Pad size is 1.475 x 0.3mm, and the new aperture size is 1.32 x 0.22mm. I'm not sure about whether or not it is lasered, but on the newly ordered stencil I selected the polishing option. Looks like the pad width is already 2/3
Electronics Forum | Tue Mar 28 08:29:04 EST 2006 | davef
Pad design - Standard IPC 20 pitch QFP Thermal pad design - Layout the thermal pad 0mm to 0.15mm larger per side (0mm to 0.30mm larger overall) than the exposed die pad on the package. �Larger than�, as opposed to the same size, is preferred. Obvio
Electronics Forum | Sun Apr 04 08:03:41 EDT 2004 | davef
There certainly is a problem, but it�s unclear from your description whether the source of the problem is: * Design * Soldering * Component quality * A combination Recognizing the SMT connectors see stress that other SMT component do not, you give t
Electronics Forum | Thu Jan 02 10:31:48 EST 2020 | slthomas
It is strange that you're having issues while using the same process parameters (including stencil) that worked successfully before. It doesn't guarantee that it's not one of those parameters changing in a manner that's not apparent, but it does sugg
