Parts & Supplies | Pick and Place/Feeders
SM320 J9060336A HEAD I/O BOARD SAMSUNG CP40 COMPONENT ALIGNER ASSY J9059146B AM03-005581A CABLE ASSY-Z6-Z10_HOME_SEN J67111137A FITTING KQ2L04-06 J6711250A BARB FITTING[M-5AU-2] J90600059C J91741047A - CAN_MASTER_BOARD_CP45 VER 1.1 J9065258A
Parts & Supplies | Pick and Place/Feeders
mounter Decan F2 J9055256A CN140 NOZZLE SAMSUNG CP40 COMPONENT ALIGNER ASSY J9059146B AM03-005581A CABLE ASSY-Z6-Z10_HOME_SEN J67111137A FITTING KQ2L04-06 J6711250A BARB FITTING[M-5AU-2] J90600059C J91741047A - CAN_MASTER_BOARD_CP45 VER 1.1
Industry News | 2021-10-31 04:57:58.0
Averatek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California. The paper was co-authored by Nazarali Merchant, Ph.D., Senior Materials Scientist for Averatek.
Industry News | 2022-01-03 07:38:59.0
Averatek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California. The paper was co-authored by Nazarali Merchant, Ph.D., Senior Materials Scientist for Averatek.
Industry News | 2014-08-22 13:28:43.0
Speedline Technologies will exhibit PCB assembly technology solutions, including an MPM Momentum printer and Electrovert Aquastorm 50 Batch Cleaner, in Booth #637 at SMTA International 2014. Speedline's Isaiah Smith, Senior SMT Printing Application – Sales Engineer, will also present "Advances in Fine Pitch Printing Process Technology" in the Technical Conference.
Advanced Solder Paste Printer with 2D SPI On-Board. Auto screen printers with Advanced Vision System for all PCB types. Standard Features Include: 2D Solder Paste Inspection 3 Stage Automatic Conveyor Under Stencil Cleaning Ful
Advanced Dual Lane Solder Paste Printer with 2D SPI On-Board. Dual lane screen printers with Advanced Vision System for all PCB types. Standard Features Include: 2D Solder Paste 3 Stage Automatic Under Stencil Cleaning Full Proce
Advanced LED Solder Paste Printer with 2D SPI On-Board LED screen printer with Advanced Vision System for all PCB types Standard Features Include: 2D Solder Paste 3 Stage Automatic Under Stencil Cleaning Full Process Control
MODEL NAME:HP-350M ;HP-520S ; HP-680S ; HP-850S ; HP-1000S Benefit High speed printing realization (2.0Cpk @ ±25㎛) Fine Pitch(0.2mm) , CSP , 0402 Control of printing speed and pressure over 5 sections Various P
New Equipment | Solder Paste Stencils
DESEN Hito SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±18μm@,6σ Process Alignment Capability ≥2 Cpk@±8μm@,6σ Cycle Time 7s Maximum Print Area 400mm
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