Full Site - : passive component recommended footprint (Page 11 of 15)

Combining two similar footprints - absolute no, or might work - tips to improve odds?

Electronics Forum | Mon Apr 14 17:38:18 EDT 2014 | bradlevy

I've got a small smt board I've already got working prototypes of, which uses a tactile switch. I've got another much less expensive tact switch of similar size that I had avoided due to a difference in actuators I originally had no way around. Now I

Reflowing a PowerPak SO-8

Electronics Forum | Wed Nov 05 08:24:16 EST 2003 | Paul O ' Connor

When reflowing a Vishay PowerPak SO-8 & using the recommended footprint from the data sheet, the component is skewing in reflow, to solve this we have to add a glue dot to both sides of the part, will making the PCB land pad 1:1 with the Solderable

Looking for some help with Samtec SEAM-GP mounting

Electronics Forum | Tue Oct 28 17:15:46 EDT 2014 | grayboard

Hello, I am looking into the use of a Samtec SEAM-50-02.0-L-10-2-A-GP-K-TR on a board. Is anyone around who has experience with this component? Specifically, we are looking for design advice for stenciling and soldering. The component is a sold

112 pin TQFP PV

Electronics Forum | Thu Apr 09 00:07:54 EDT 1998 | Bonnie

I am in urgent need of a pcb land patten (footprint)for this device. I have the component data sheet with with package dimensions from Motorola, but they do not include the recommended land pattern. I requested a patten over a week ago, but have no

Re: 112 pin TQFP PV

Electronics Forum | Thu Apr 09 00:12:02 EDT 1998 | Bonnie

| I am in urgent need of a pcb land patten (footprint)for this device. I have the component data sheet with with package dimensions from Motorola, but they do not include the recommended land pattern. I requested a patten over a week ago, but have

Re: pre-heat settings for wave solder - Hi Dave F !

Electronics Forum | Thu Jun 22 12:40:40 EDT 2000 | Boca

Everybody's right! Two concerns are proper preheat for the flux and reduced thermal shock to surface mount components. The stupid er dumb thing is that these can be at odds with each other. The flux vendor usually specs topside temp before wave.

Re: Standard pad sizes for reflow and wave

Electronics Forum | Sun Sep 05 03:52:11 EDT 1999 | Brian

| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes

mydata tp9 vs philips topaz

Electronics Forum | Sat Nov 17 10:24:17 EST 2007 | etienne

Hi, I can give my opinion in this topic since I worked with both machines. To say the truth, I would recommend neither machine. First of all, operating software is much quite the same for both machines. The TP9 is true that has a larger footprint ov

Combining two similar footprints - absolute no, or might work - tips to improve odds?

Electronics Forum | Tue Apr 15 15:12:50 EDT 2014 | bradlevy

Thanks Bob. I just didn't have enough experience with production SMT (vs hand-soldered prototypes) to know how finicky some things like this are. I've tried to do a lot of reading, but I haven't seen much that talks about things like this. I also hav

Re: SMT

Electronics Forum | Mon Sep 21 08:14:14 EDT 1998 | Steve Gregory

| Hello: | I would like to know what causes tombstombing and how can it be prevented? | Thx. | Nichol Hi Nichol! A tombstone happens when solder doesn't wet equally on both terminations during reflow...now why that happens can be found by looking at


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