Electronics Forum | Tue Jul 13 13:28:18 EDT 1999 | Upinder Singh
| | Hi all , | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | 1. Is underfill required for micro-BGAs? | | | | 2. What type of stencil apertures are the industry st
Electronics Forum | Sat Mar 18 02:21:31 EST 2006 | pavel_murtishev
Good morning, Once again a met annoying solder beading issue while producing board with PLL (leadless, contacts from the bottom side of the package). Board has very high placement density and beads appear near PLL package only. This package is finep
Electronics Forum | Wed Feb 23 16:49:08 EST 2000 | Dave F
John we paced through the same question recently. Both automatic dispensers and printers can be used to deposit SMT adhesive or solder paste on substrates with a relatively high component density. Dispensers are superior to printers in terms of exa
Electronics Forum | Wed Feb 23 16:49:08 EST 2000 | Dave F
John we paced through the same question recently. Both automatic dispensers and printers can be used to deposit SMT adhesive or solder paste on substrates with a relatively high component density. Dispensers are superior to printers in terms of exa
Electronics Forum | Mon Jul 12 14:30:37 EDT 1999 | Earl Moon
| Hi all , | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | 1. Is underfill required for micro-BGAs? | | 2. What type of stencil apertures are the industry standards for uB
Electronics Forum | Tue Jul 13 13:51:51 EDT 1999 | Earl Moon
| | | Hi all , | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | 2. What type of stencil apertures are t
Electronics Forum | Thu Nov 10 15:43:10 EST 2005 | 1st Article
myu, Is using a 0.6mm stencil wise? 42.5 X 42.5 has two models, the 1mm pitch has 41x41 array with 1657 I/O and the 1.27mm pitch has 33x33 with 1088 I/O. For a typical c-cga with 1.0mm - 1.27mm pitch, may requires a 2mil stencil, 1.0mm pitch gets .
Electronics Forum | Tue Jul 13 15:04:24 EDT 1999 | Scott McKee
| | | | Hi all , | | | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | | | 2. What type of stencil a
Electronics Forum | Mon Jul 17 13:37:35 EDT 2006 | carln
Here is something I copied from Circuitnet.com. This appears to answer your question and then some... http://www.circuitnet.com/experts/ Ask the Experts Jul 17, 2006 What type of cleaner method is preferred for lead-free stencils? What type of s
Electronics Forum | Fri Jul 16 14:05:04 EDT 1999 | Jim Blankenhorn
| | | Hi all , | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | 2. What type of stencil apertures are t
