Electronics Forum | Wed Feb 01 08:12:04 EST 2006 | Chunks
OK, this is easy. You say HIGH fall out, so I can assume 25 or 50%? If so, run 10 without the heat gun and 10 with. This should show you if the heat gun process is the cause or not. If the relay is a surface mount, hand solder them on. If it's a
Electronics Forum | Tue Feb 17 15:24:17 EST 2009 | glynnhamer
I know this is going to sound rather sad, but we have been using a Capton tape for years that contains silicone to mask large components as they go over the wave, as well as large plated holes on the pcb. It was handed down for years as accepted prac
Electronics Forum | Mon Dec 03 10:47:11 EST 2007 | slthomas
I thought you said that the parts that weren't wetting in reflow were the parts with epoxy. The question I have is do they wet in wave solder, and if they do, why does it matter what happens to them in reflow? Conversely, if they don't wet in wave,
Electronics Forum | Fri Sep 07 11:46:29 EDT 2018 | dleeper
Air gap on the PCB is determined the pad spacing which in turn is governed by the component. As long as the PCB designer is following the typical BGA layout best practices; i.e no open via in pad, non-solder mask defined pads, solder mask covered tra
Electronics Forum | Fri May 08 08:12:32 EDT 1998 | Steve Gregory
| I am running a board that is .062" thick and has components that over hang the edge of the board by .090". I have bottom side smt components (chip caps and resistors only) and use the turbulent wave to help solder the components. The problem I am
Electronics Forum | Wed Jul 07 14:14:03 EDT 1999 | Dave F
| Is anyone aware of some guidelines regarding through-hole in SMT pads? One of our designers wants to add through-hole leads in some SMT pads for an inductor. The size of the hole is 0.032 inches and takes-up approximately 25% of the pad area. Th
Electronics Forum | Sun Oct 10 17:50:00 EDT 1999 | JohnW
| | We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almost
Electronics Forum | Mon Oct 11 11:13:32 EDT 1999 | Wirat S.
| | | We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almo
Electronics Forum | Wed Jul 07 13:56:57 EDT 2004 | Pierre RICHARD
As converting our boards to lead-free finish (Immersion White Tin) we decided to change de mask color from green to blue. We thought this would be a good idea to spread the idea so we could easily recognize the type of solder application related to t
Electronics Forum | Thu Aug 08 16:18:22 EDT 2013 | horchak
Placing and re-flowing the shield is of course the most economical. But once the shield is placed and reflowed this all but rules out inspection test and rework. Reflow should not be an issue if you have a decent forced air convection oven. You may w
