Industry News | 2012-11-13 09:35:09.0
Comprehensive updates on pressing industry concerns, challenges and developments will be addressed in 50 IPC APEX EXPO® professional development courses, February 17–18 and February 21, 2013, at the San Diego Convention Center.
Industry News | 2022-11-11 07:33:41.0
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.
Industry News | 2011-03-11 17:28:15.0
Very few attendees can — or even try — to take advantage of all of the resources on-site at IPC APEX EXPO, taking place April 12–14, 2011 in Las Vegas. To optimize their time at the event, visitors can get even more questions answered at free educational "BUZZ Sessions" taking place on the show floor. Panelists at these interactive discussion forums will discuss many of the topics keeping the electronics manufacturing industry buzzing.
Industry News | 2011-08-24 17:13:21.0
The IPC Conference on Reliability: Assembly Process for a Reliable Product will be held November 1-2, 2011, in Irvine, Calif. The conference will address reliability issues that arise at the assembly level, dedicating half-day programs on new developments in each of three key areas: materials, processes, and test and inspection.
Industry News | 2011-12-02 18:36:19.0
Manufacturing and quality engineers looking for solutions to process challenges will find answers at the NPL Process Defect Database Clinic at IPC APEX EXPO®, February 28-March 1, 2012, at the San Diego Convention Center. Organized by IPC and the National Physical Laboratory (NPL), the free clinic will be held in the exhibit hall to assist event attendees with assembly and soldering process problems, RoHS compliance issues, solderability concerns, field failures and other process-related issues.
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
New Equipment | Solder Materials
KappaTinning Compound is a dry mixture of pure powdered Tin and flux specifically designed for pre-tinning cast Iron, Steel, Bronze and Copper bearing shells. A one pound container of KappaTinning Compound contains about twice as much Tin and goes fu
Parts & Supplies | SMT Equipment
Description: SMD Component Counter Features: 1. High precision with zero defects. 2. Ability of counting in bi-direction. 3. Rapid Pre-Set function confirmation. Technical specification: 1. Power Supply: AC110V or AC220V (convertible) 2. Capa
Used SMT Equipment | Soldering - Wave
New arrival Electrovert EPK Plus Wave Solder Machine, 208VAC 3 phase power, L to R Board Flow, Heavy Duty V and L finger mix, Manual Board Width Adjust , 16" Max Board Width, Finger Cleaner, Originally Configured with an internal Foam Flux
