New Equipment | Assembly Services
Vishay New and Original 90MT160KB in Stock IC MTK package 90MT160KB BRIDGE RECT 3PHASE 1.6KV 90A MTK O3853QDCARQ1 HTSSOP-48 TI 22+ TMS320F28377DPTPT HLQFP176 TI 22+ STM32H743ZIT6 QFP144 ST 21+
New Equipment | Assembly Services
TI New and Original SN65DSI84TPAPRQ1 in Stock IC HTQFP-64 22+ package SN65DSI84TPAPRQ1 MIPI® DSI Bridge to FlatLink™ LVDS Single Channel DSI to Dual Link LVDS Bridge NCV7720DQAR2G SSOP24 ON 22+ NUP2105LT1G SOT23 ON 22+ IS42S16400J-6TLI TSOP54 I
Industry News | 2015-09-17 16:33:30.0
The VUB300 is a single-chip USB-to-SDIO hardware bridge that allows SDIO- and SD-compliant devices to be connected to a host PC via its USB port.
New Equipment | Assembly Services
Rectron New and Original RS407M in Stock IC RS-4M , 21+ package RS407M Bridge Rectifiers PIC16F1503T-I/MG QFN-16 Microchip 21+ 24LC128T-I/MNY TDFN-8 MICROCHIP 22+ NCP1403SNT1G SOT23-5 ON 21+ NCP1622BECSNT1G SOT23-6 ON 22+ TPS7A6650QDGNR
New Equipment | Assembly Services
TI New and Original SM72295MAX/NOPB in Stock IC SOIC-28 22+ package SM72295MAX/NOPB, 100V Full Bridge Gate Driver with Integrated Current Sense Amplifier CY62157EV30LL-45ZSXIT TSOP44 CYPRESS 21+ CRCW04020000Z0ED SMD
New Equipment | Assembly Services
TI New and Original DRV8833PWPR in Stock IC HTSSOP16 , 21+ package DRV8833PWPR 10.8V, 2A, Dual H-Bridge Motor Driver with Current Regulation Today's Hot Deals： SI3050-E1-FTR TSSOP20 SILICON 21+ ET1100-0000 BGA Beckhoff 15+ HCPL-2211 SOP8
Industry News | 2022-01-10 16:39:30.0
Indium Corporation's Ron Lasky, Ph.D., PE, senior technologist, will share his industry knowledge and expertise during two presentations at the SMTA Pan Pacific Microelectronics Symposium (SMTA PanPac), Jan. 31-Feb. 3, Honolulu, O'ahu, Hawaii, U.S.
Industry News | 2022-11-28 07:00:51.0
With the development of the precision and stability of SMT equipment, the manufacturing process and testing links have gradually become the key to the development of the industry. At the same time, the fierce competition in the consumer electronics market has put forward higher requirements for the quality of electronic components. In the production process, it is necessary to use various testing technologies to inspect defects and faults in time and repair them, among these testing technologies, X-ray inspection is one of the most critical process to improve the SMT BGA QFN soldering quality.
Industry News | 2013-04-03 18:52:22.0
SMART Group,announces that on 26th March 2013, more than 30 delegates from manufacturing and service repair sectors, including line managers, process and quality engineers, attended its successful “Back to Basics” Hands-on Rework and Inspection Workshop at the Manufacturing Technology Centre in Coventry, UK
Rectron New and Original RS407M in Stock IC RS-4M , 21+ package RS407M Bridge Rectifiers PIC16F1503T-I/MG QFN-16 Microchip 21+ 24LC128T-I/MNY TDFN-8 MICROCHIP 22+ NCP1403SNT1G SOT23-5 ON 21+ NCP1622BECSNT1G SOT23-6 ON 22+ TPS7A6650QDGNR
