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E3G BGA Rework Station

E3G BGA Rework Station

New Equipment | Rework & Repair Equipment

The PDR E3G Evolution - Next Generation Rework System -  is made of only the finest materials and components for optimum precision and rework excellence. Combining PDR's ThermoActive software technology with PDR's patented Focused - Visible IR Techno

PDR-America

PACE SX-100 Sodr-X-Tractor Desoldering Handpiece (comes with ST-115)

PACE SX-100 Sodr-X-Tractor Desoldering Handpiece (comes with ST-115)

Videos

The SX-100 Sodr-X-Tractor is the solder extraction handpiece for high volume operations. It uses PACE's new SX-100 desoldering tips, the longest lasting desoldering tips availible on the market today. The SX-100 features a disposable collection chamb

PACE Worldwide

Reworking a BGA with the PDR Focused IR-E3 (inc.BGA vision alignment) Rework Station

Reworking a BGA with the PDR Focused IR-E3 (inc.BGA vision alignment) Rework Station

Videos

This is an indepth video showing you how to rework a BGA using the PDR IR-E3 with CCTV/Split prism vision alignment rework station from our Evolution series. We call this system the E3Vi For further details on PDR Focused IR rework stations/systems

PDR-America

Circuit Board, SMT, OEM Turnkey Service

Circuit Board, SMT, OEM Turnkey Service

New Equipment |  

PCBA , Printed Circuit Board Assembly, PCB Assembly , EMS pcba, Electronic Manufacturing OEM PCBA Tronixlink PCB Assembly line includes the latest process in SMT and wave soldering along with SIP, AOI, X-ray, ICT and functional testing. Our SMT capab

Tronixlink PCB PCBA

Highly Flexible and Fast SMD Assembly Machine - Essemtec Introduces New Cobra Pick-and-Place System at SMTA International

Industry News | 2010-09-29 23:17:20.0

Cobra is one of the most modern SMD pick-and-place systems in the world. Latest drive and material technologies combined with quick changeover concepts make it an extremely reliable, fast and flexible workhorse for both high-volume and high-variety production.

ESSEMTEC AG

PACE TF 1800 & TF 2800 SMD/BGA Rework Stations for Repair of BGA, CSP, QFN, 0201, BTC and other SMD components

PACE TF 1800 & TF 2800 SMD/BGA Rework Stations for Repair of BGA, CSP, QFN, 0201, BTC and other SMD components

Videos

Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an

PACE Worldwide

PACE TF 1800 & TF 2800 SMD/BGA Rework Stations for Repair of BGA, CSP, QFN, 0201, BTC and other SMD components

PACE TF 1800 & TF 2800 SMD/BGA Rework Stations for Repair of BGA, CSP, QFN, 0201, BTC and other SMD components

Videos

Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an

PACE Worldwide

Benchtop Convection SMT Reflow Oven T200C

Benchtop Convection SMT Reflow Oven T200C

New Equipment | Reflow

Benchtop Convection SMT Reflow Oven T200C Product Description Honor customer : TORCH brand desktop reflow oven has got purchse order from TOP 500 enterprises: GE, CISCO, 3M, TI, NVIDIA, Nortel Network ect last year, especially GE and CISCO, totall

Beijing Torch Co.,Ltd

Reworking a BGA with the PDR Focused IR-E3 (inc.BGA vision alignment) Rework Station

Reworking a BGA with the PDR Focused IR-E3 (inc.BGA vision alignment) Rework Station

Videos

This is an indepth video showing you how to rework a BGA using the PDR IR-E3 with CCTV/Split prism vision alignment rework station from our Evolution series. We call this system the E3Vi For further details on PDR Focused IR rework stations/systems

PDR-America

qfp reflow problems

Electronics Forum | Thu Apr 15 16:07:37 EDT 2004 | barry

Hi there all, we are having problems with 2 qfp devices. grainy poorly reflowed solder joints. One 100 pin .5mm pitch, and one 64 pin .5 mm pitch . Both of these devices have a thermo pad on the back of them (pad area soldered to back of device)which


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