Industry News | 2010-11-18 11:04:08.0
MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Arizona-Sonora Expo & Tech Forum, scheduled to take place Wednesday, December 1, 2010 at the Fiesta Inn Resort & Conference Center in Tempe, AZ.
Industry News | 2011-10-07 23:08:54.0
MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA LA/Orange County Expo & Tech Forum.
Industry News | 2012-04-19 09:00:53.0
MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA Toronto Expo & Tech Forum,
Industry News | 2012-05-31 21:36:12.0
MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA Upper Midwest Expo & Tech Forum
Industry Directory | Manufacturer
Ball Grid Array IC Reconditioning, Re-Ball Service, BGA IC Purchase and Resale
Industry Directory | Manufacturer
Majelac Technologies offers quick turn IC assembly services, including open cavity QFN, wafer dicing, die sorting, wire bonding, BGA reballing, BGA assy, prototype assembly, fine pitch wire bonding, and more,
Industry Directory | Consultant / Service Provider
Serves the electronic manufacturing industry in Turkey by representing foreign companies, as well as importing and sales of various products. Designs and manufactures BGA reballing masks.
Industry Directory | Consultant / Service Provider / Manufacturer
Manufacturing SMT Stencil, Reballing stencil. SMT pallet; Wave solder pallet and Engineering Services
Industry Directory | Manufacturer
We are Malaysia Public Listed company subsidiary with capability in BGA, Reworking, Reballing, X-Ray, SMT, 0402 Chip, AI, ICT and F/A. We are ISO 9001 certified with RoHS Compliant and LMW status which is for free tax to service oversea customers.
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