Industry News | 2015-04-21 16:39:45.0
Metcal is pleased to announce that it was awarded a 2015 SMT China Vision Award in the category of Repair & Rework for its APR-2000-SCS Scarab Site Cleaning System. The award was presented to the company during an April 21, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.
Industry News | 2004-04-27 15:19:57.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.
SMT 256B series dip adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application. SMT 256B is a kind of polymer adhes
SMT266 offers all the features and advantages of our SMT256 series, in a convenient jetting adhesive form (and can also be brushed on during rework). SMT 266 series spray adhesives have been designed to enhance solder joint reliability and eliminat
World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
New Equipment | Surface Finish
FlexTRAK plasma treatment systems offer high-throughput, strip-type, and inline boat processing for advanced semiconductor packaging applications. The FlexTRAK/FlexTRAK-S, FlexTRAK-CD/FlexTRAK-CDS, FlexTRAK-2MB, and FlexTRAK-SHS systems suit various
SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and
Industry News | 2003-09-25 13:32:47.0
Reduce waste and cost.
New Equipment | Rework & Repair Equipment
Underheater for demanding soldering Applications for underheaters range from pre-heating of PCBs for hand soldering tasks over pre-heating for automated machine rework to curing or cracking of underfill. MARTIN offers a wide choice of underheater
Industry News | 2015-11-18 13:15:58.0
Albany, NY – YINCAE Advanced Materials, LLC is proud to announce that our company was awarded the 2015 Global Technology Award in the adhesives, coatings, and encapsulants category! This ceremony took place on Tuesday, November 10th at the Productronica Global Exhibition in Munich, Germany.
