Full Site - : resistor array bridgeing (Page 19 of 27)

Resistor Net Array , Stencil Design

Electronics Forum | Tue Mar 25 15:36:38 EST 2003 | Ren� Sandoval

What is the optimal design for the resistor Net Array 0402 (8 pins)with a 5 mils Stencil th.?

WAVE SOLDERING 0603 CHIP RESISTOR ARRAYS

Electronics Forum | Mon Apr 10 11:56:35 EDT 2000 | Robert Hutton-Squire

Suggestions please... I have to place a number of 1206 chip resistor arrays on the bottom side of my PCB for wave soldering. The device consists of 4 x 0603 resistors in a 1206 package. The device is available with either concave or convex terminati

Re: WAVE SOLDERING 0603 CHIP RESISTOR ARRAYS

Electronics Forum | Wed Apr 12 20:41:31 EDT 2000 | Dave F

Russ: That�s a pretty stand-up postin� bud. It�s neat that you can root-out that dirt. We couldn�t dig-up that stuff, if they threatened to shoot the dog. You could be correct about using convex for waving. We don�t wave RNET as Philips suggests

Flux activity with SAC305

Electronics Forum | Thu Jul 28 09:10:55 EDT 2005 | Cmiller

What stencil reduction are you using so the resistors dont bridge??

BGA ball vs land design problem??

Electronics Forum | Thu Jun 04 20:06:30 EDT 2009 | davef

Since posting the above comment extolling the virtues of NSMD pads and disparaging SMD pads, we've learned that the points apply to all array devices, but in spite of that some designers of fine pitch [eg, 0.4, 0.5mm pitch] array devices choose SMD w

Stencil Design for Resistor Net Array 0402

Electronics Forum | Wed Mar 26 17:09:52 EST 2003 | Jos�

For the Resistor Network Array SMT 0402- 8 pads I'm using a Stencil 5 mils Th. with the next appertures : Corners-biggers pads: 24 x 12 mils Center pads : 9 x 24 mils This Appertures are working excelent for the RN's that his appertures are parallel

Very fishy missing solder paste issue

Electronics Forum | Mon Jul 18 18:02:31 EDT 2005 | seaK

Thanks for the response..... The solder is actually printed okay prior to SMT.... And after placing, found missing solders at middle terminals of 0408 resistor arrays.... Package library is checked, component spec looks fine... I am suspecting the

CBGA

Electronics Forum | Mon Feb 25 21:09:48 EST 2002 | davef

You are correct about a TCE [CTE] mismatch issues in ceramic packages. The coefficient of thermal expansion [ppm/�C] of major ceramic package elements are: * Silicon - 3 * Standard 92% alumina ceramic � 6.5 * FR4 board � 18-20 Several points are: *

Re: WAVE SOLDERING 0603 CHIP RESISTOR ARRAYS

Electronics Forum | Tue Apr 11 10:36:35 EDT 2000 | Russ

Quick question for Dave, Out of curiosity, why concave? I ask because we are soldering RNETs that come in either style and have not payed much attention to this. Russ

Solderability of Resistor Network Arrays

Electronics Forum | Wed May 29 22:00:19 EDT 2002 | davef

Not sure of the package style or the specific problem you're talking about, but consider searching the fine SMTnet Archives since we have talked about this previously, several times.


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