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RapidSMTAssembly Unveils Its 2009 Green Initiative

Industry News | 2009-05-19 14:19:21.0

Design for Low-Halogen Green Electronics is Ultra-Clean

RapidSMTAssembly

Testing Intermetallic Fragility on Enig upon Addition of Limitless Cu

Technical Library | 2014-01-23 16:49:55.0

As reliability requirements increase, especially for defense and aerospace applications, the need to characterize components used in electronic assembly also increases. OEM and EMS companies look to perform characterizations as early as possible in the process to be able to limit quality related issues and improve both assembly yields and ultimate device reliability. In terms of BGA devices, higher stress conditions, RoHS compatible materials and increased package densities tend to cause premature failures in intermetallic layers. Therefore it is necessary to have a quantitative and qualitative test methodology to address these interfaces.

Universal Instruments Corporation

Method for the Manufacture of an Aluminum Substrate PCB and its Advantages

Technical Library | 2015-09-17 17:36:56.0

RoHS legislated restrictions on the materials used in electronics manufacture have imparted significant challenges on the electronics industry since their introduction in 2006. The greatest impacts have been felt by the mandated elimination of lead from electronic solder followed by the demand for the elimination of haloids from flame retardants used in traditional PCB laminates. In the years which have followed the electronics industry has been beset with a host of new challenges in its effort to comply. Failure mechanisms, both new and old, have surfaced which demand solution and the industry suppliers and manufacturing technologists have worked diligently to remedy those vexing faults through the development of a wide range of new materials and equipment for both board manufacture and assembly, along with modifications to the processes used in the manufacture and assembly of printed circuit boards.

Verdant Electronics

PNC - Manufacturer of Printed Circuit Board from PCB Design, Layout, PCB fabrication & PCB Assembly.

PNC - Manufacturer of Printed Circuit Board from PCB Design, Layout, PCB fabrication & PCB Assembly.

Videos

Manufacturer of Printed Circuit Board from PCB Design, Layout, PCB fabrication & PCB Assembly.

PNC Inc.

Delta Group Electronics Inc

Industry Directory | Consultant / Service Provider / Manufacturer

Established in 1987, Delta Group is a high-mix medium volume to low-mix medium quantity run electronics manufacturing services (EMS) provider.

Altronics Manufacturing Inc

Industry Directory |

Electronic contract assembly of complex printed circuit boards (PCB), backplanes, RF, chassis, cables, press-fit connectors, and electro-mechanical assemblies. Services include: DFM, turn key, consignment, prototype, and quick turn. www.altronicsmfg.com

Shin Puu Technology Co., Ltd

Industry Directory | Manufacturer

SP is a high mix low to medium volume PCB + PCBA shop located in Taiwan. We are in business since 2001 with over 1,000 active customers and certified to ISO-9001, ISO-14001 standards.

Indium's NanoBond® Process

Indium's NanoBond® Process

Videos

How the NanoBond® Process works

Indium Corporation

LOCTITE HF 212 Halogen-Free Solder Paste

LOCTITE HF 212 Halogen-Free Solder Paste

New Equipment | Solder Materials

8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr

Henkel Electronic Materials

ESD Plastic Trays

ESD Plastic Trays

New Equipment | IC Packaging

Name: Vacuum Formed Trays, ESD Shipping Trays, Plastic Trays Material: PS, PETG, ABS, PVC AntiStatic Certificates: RoHs, ISO14001 Payment Term: 100% T/T Capacity: 100000pcs/week MOQ: 5000 pieces Sample Time: 5 days including tooling making Lead Time

Shenzhen Sewate Technology Co.,Ltd


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